Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Choi, HangChul"'
Autor:
Mohan Nagar, A. Bansal, Choi HangChul, John Savic, Raj Pendse, Weidong Xie, Lee SangHo, Park Gun Oh, Mudasir Ahmad, David Senk, Nokibul Islam
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
High speed network packaging solutions have pushed the limits of known manufacturing technology into previously untested realms. Next generation ASIC's and SiP/MCM's are requiring packages in excess of 60mm × 60mm. These large package sizes present
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e767c3bfb6ed51c9e726d7199350272
https://doi.org/10.1109/ectc.2012.6248870
https://doi.org/10.1109/ectc.2012.6248870
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2016, p143-147, 5p
Autor:
Eslampour, Hamid, Joshi, Mukul, Kim, KyungOe, Wei, Sun, Chung, JaeHan, Lee, TaeWoo, Choi, HangChul, Emigh, Roger
Publikováno v:
2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p949-954, 6p