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Autor:
Cho, Jea Min, Kim, Seung Soo, Park, Tae Won, Shin, Dong Hoon, Kim, Yeong Rok, Park, Hyung Jun, Kim, Dong Yun, Lee, Soo Hyung, Park, Taegyun, Hwang, Cheol Seong
Publikováno v:
Nanoscale Horizons; Jan2025, Vol. 10 Issue 1, p113-123, 11p
Autor:
Park, Tae Won, Moon, Jiwon, Shin, Dong Hoon, Kim, Hae Jin, Kim, Seung Soo, Cho, Jea Min, Park, Hyungjun, Woo, Kyung Seok, Kim, Dong Yun, Cheong, Sunwoo, Song, Haewon, Shin, Jong Hoon, Lee, Soo Hyung, Ghenzi, Néstor, Hwang, Cheol Seong
Publikováno v:
ACS Applied Materials & Interfaces; 20240101, Issue: Preprints
Autor:
Park TW; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Moon J; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Shin DH; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Kim HJ; Department of Materials Science and Engineering, Myongji University, Yongin 17058, Korea., Kim SS; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Cho JM; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Park H; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Woo KS; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Kim DY; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Cheong S; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Song H; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Shin JH; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Lee SH; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea., Ghenzi N; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea.; Universidad de Avellaneda UNDAV and Consejo Nacional de Investigaciones Científicas y Técnicas (CONICET), Buenos Aires B1870, Argentina., Hwang CS; Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, College of Engineering, Seoul National University, Seoul, 08826, Republic of Korea.
Publikováno v:
ACS applied materials & interfaces [ACS Appl Mater Interfaces] 2024 Nov 27; Vol. 16 (47), pp. 65046-65057. Date of Electronic Publication: 2024 Nov 12.