Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Chng Kheaw Chung"'
Publikováno v:
2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA).
Flip chip ball grid array (FCBGA) packages is becoming more attractive for automotive applications driven by the high performance requirement. Stacked vias are widely used in FCBGA substrate due to higher routing request. The reliability of stacked v
Publikováno v:
Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).