Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Chiung-Yu Lo"'
Autor:
Shang-Chun Chen, Tzu-Chien Hsu, Jen-Chun Wang, Jui-Chin Chen, Chung-Chih Wang, Yu-Chen Hsin, Yiu-Hsiang Chang, Tsuen-Sung Chen, Hsiang-Hung Chang, Chiung-Yu Lo, Po-Chih Chang, Yuan-Chang Lee, Chih-Lin Wang, Chao-Kai Hsu, Su-Hsin Lin
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In this paper, we show the process and integration results of small TSVs integrated by 300mm 3DIC BTSV process. The TSV size is from 2um to 3um (in diameter) with aspect ratio of 10. The achievements of this work are: 1) successful demonstration of 2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72b2bb01616968cd387305033cb62095
https://doi.org/10.1109/impact.2016.7800041
https://doi.org/10.1109/impact.2016.7800041
Publikováno v:
SPIE Proceedings.
New applications on memory and logic devices need to form line shape pattern below 20 nm. Most of the prior articles for studying HSQ line CD resolution applied hot or cold (non-room temperature (RT)) development, salty development, KOH-based develop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0dd5d88c13b94d5bc041461cb7be2d38
https://doi.org/10.1117/12.2010364
https://doi.org/10.1117/12.2010364