Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Chiu, Chun‐Chia"'
Autor:
Lin, Hsiang-Yin, Lin, Chun-Yeh, Chiu, Chun-Chia, Li, Hsueh-Ju, Chen, Jyh-Horung, Wang, Shin-Shin, Tung, Jo-Yu
Publikováno v:
In Polyhedron 7 July 2017 130:30-39
Publikováno v:
In Polyhedron 24 November 2014 83:212-219
Publikováno v:
Computer Graphics Forum. Oct2015, Vol. 34 Issue 7, p225-234. 10p. 7 Color Photographs, 4 Black and White Photographs, 4 Diagrams, 2 Charts, 1 Graph.
Autor:
CHIU,CHUN-CHIA, 邱俊嘉
105
Antrodia cinnamomea is an endemic medical mushroom in Taiwan. It is well known that the major effective components in this medical fungus are polysaccharides, triterpenoids and steroids. Since the amount of triterpenoids has been considered
Antrodia cinnamomea is an endemic medical mushroom in Taiwan. It is well known that the major effective components in this medical fungus are polysaccharides, triterpenoids and steroids. Since the amount of triterpenoids has been considered
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/z9duhh
Autor:
Chiu, Chun Chia, 邱俊嘉
103
Circular scribble art is a kind of line drawing where the seemingly random, noisy and shapeless circular scribbles at microscopic scale constitute astonishing grayscale images at macroscopic scale. Such a delicate skill has rendered the crea
Circular scribble art is a kind of line drawing where the seemingly random, noisy and shapeless circular scribbles at microscopic scale constitute astonishing grayscale images at macroscopic scale. Such a delicate skill has rendered the crea
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/81727970173009294570
Autor:
Chiu, Chun-chiang
The goal of this thesis is to develop a novel polishing tool system, which can be attached to a CNC machine tool and execute a precision polishing job for an axially symmetric free surface. The precision polishing job is to remove the error surface p
Publikováno v:
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference [Annu Int Conf IEEE Eng Med Biol Soc] 2022 Jul; Vol. 2022, pp. 3207-3210.