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pro vyhledávání: '"Chip scale packages"'
Akademický článek
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Publikováno v:
International Journal for Simulation and Multidisciplinary Design Optimization, Vol 13, p 7 (2022)
The complexity challenges of mechatronic systems justify the need of numerical simulation to efficiently assess their reliability. In the case of solder joints in electronic packages, finite element methods (FEM) are commonly used to evaluate their f
Externí odkaz:
https://doaj.org/article/48bbe233fac84b508e9f06a57a45c4da
Publikováno v:
MATEC Web of Conferences, Vol 286, p 02002 (2019)
In the mechatronic devices, the finite element analyses are the most used method to determine time-dependent solder joint fatigue response under accelerated temperature cycling conditions, the deterministic analyses are the most used methods. However
Externí odkaz:
https://doaj.org/article/a7b023caf7394e07a1cd3b0b8a2a9198
Publikováno v:
Microelectronics Reliability. 139
Board level vibration testing is intended to assess prediction of the reliability of solder joint interconnects that are formed between electronic components and printed circuit boards (PCB). Frailties in the stress test experiment might lead to fals
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dris___00893::29564d51959afa81734c536556557bd2
https://doi.org/10.1016/j.microrel.2022.114830
https://doi.org/10.1016/j.microrel.2022.114830
Autor:
Thukral, V., van Soestbergen, M., Zaal, J.J.M., Roucou, R., Rongen, R.T.H., van Driel, W.D., Zhang, Kouchi
Publikováno v:
Microelectronics Reliability, 139
Board level vibration testing is intended to assess prediction of the reliability of solder joint interconnects that are formed between electronic components and printed circuit boards (PCB). Frailties in the stress test experiment might lead to fals
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=narcis______::1a0b9a4b791f9d0003f9d3cc46696bef
http://resolver.tudelft.nl/uuid:a9b66489-69b5-4689-8a24-bd21ca9ed105
http://resolver.tudelft.nl/uuid:a9b66489-69b5-4689-8a24-bd21ca9ed105
Publikováno v:
International Journal for Simulation and Multidisciplinary Design Optimization, Vol 13, p 7 (2022)
International Journal for Simulation and Multidisciplinary Design Optimization
International Journal for Simulation and Multidisciplinary Design Optimization, 2022, 13, pp.7. ⟨10.1051/smdo/2021038⟩
International Journal for Simulation and Multidisciplinary Design Optimization, EDP sciences/NPU (China), 2022, 13, pp.7. ⟨10.1051/smdo/2021038⟩
International Journal for Simulation and Multidisciplinary Design Optimization
International Journal for Simulation and Multidisciplinary Design Optimization, 2022, 13, pp.7. ⟨10.1051/smdo/2021038⟩
International Journal for Simulation and Multidisciplinary Design Optimization, EDP sciences/NPU (China), 2022, 13, pp.7. ⟨10.1051/smdo/2021038⟩
The complexity challenges of mechatronic systems justify the need of numerical simulation to efficiently assess their reliability. In the case of solder joints in electronic packages, finite element methods (FEM) are commonly used to evaluate their f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3c67414fb021a394d98a0e0b2d59042b
https://www.ijsmdo.org/articles/smdo/full_html/2022/01/smdo210113/smdo210113.html
https://www.ijsmdo.org/articles/smdo/full_html/2022/01/smdo210113/smdo210113.html
Publikováno v:
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Power electronic modules require multi-layer architectures, where the layers provide dedicated functions, e.g. active semiconductor chip, electric conduction layer, heat spreader, insulation layer. All the layers have different material properties, l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::02be5833523affb423ff91365f224483
https://doi.org/10.1109/therminic49743.2020.9420523
https://doi.org/10.1109/therminic49743.2020.9420523
Autor:
Savolainen, Petri
Publikováno v:
Microelectronics International: An International Journal, 1998, Vol. 15, Issue 1, pp. 35-38.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/13565369810199112
Akademický článek
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Akademický článek
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