Zobrazeno 1 - 10
of 417
pro vyhledávání: '"Chip carrier"'
Autor:
L. C. Tan, Mohd Faizul Mohd Sabri, Andri Andriyana, D. Zhou, B. Y. Low, A.S.M.A. Haseeb, Yew Hoong Wong, X. S. Pang, P. L. Eu
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:435-443
Due to the variation of temperature during service, the leads in quad flat packages (QFP) and plastic leaded chip carrier (PLCC) undergo high thermal stress, which can lead to large deformation and failure. Thus, the prediction of thermal stress and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4edde0477e34af2e8897a5179deb73b5
https://doi.org/10.1109/tcpmt.2020.3046750
https://doi.org/10.1109/tcpmt.2020.3046750
Autor:
Koji Yamada, Hitoshi Kawashima, Shu Namiki, Keijiro Suzuki, Kazuhiro Ikeda, Ryotaro Konoike, Guangwei Cong
Publikováno v:
Journal of Lightwave Technology. 39:1096-1101
In this article, we report the development of a strictly non-blocking 8 × 8 silicon photonics switch designed to operate in the O-band. This 8 × 8 switch is based on path-independent insertion-loss topology and is composed of 2 × 2 thermo-optic do
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c39d13efb2691649939839dc145add9d
https://doi.org/10.1109/jlt.2020.3024016
https://doi.org/10.1109/jlt.2020.3024016
Autor:
Yi-Kuang Yen, Chao-Yuan Chiu
Publikováno v:
Scientific Reports, Vol 10, Iss 1, Pp 1-8 (2020)
Scientific Reports
Scientific Reports
Small molecule compounds are necessary to detect with high sensitivity since they may cause a strong effect on the human body even in small concentrations. But existing methods used to evaluate small molecules in blood are inconvenient, costly, time-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::437cd1e2e08cbc222651d0eddd75a9ad
http://link.springer.com/article/10.1038/s41598-020-60057-8
http://link.springer.com/article/10.1038/s41598-020-60057-8
Autor:
Keiji Matsumoto, Hiroyuki Mori, Sayuri Kohara, Marc A. Bergendahl, Kamal K. Sikka, Takashi Hisada
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
The recently introduced Direct Bonded Heterogeneous Integration (DBHi) Si bridge technology [1] consists of chips directly connected by a bridge chip though Cu pillars, enabling high speed and high band-width communication between CPUs, GPUs and memo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::70a36e225d53777abecb0f4f4b24ba88
https://doi.org/10.1109/ectc32696.2021.00222
https://doi.org/10.1109/ectc32696.2021.00222
International Telemetering Conference Proceedings / October 28-31, 1996 / Town and Country Hotel and Convention Center, San Diego, California
Eutectic (63% tin-37% lead) or near-eutectic (40% tin-60% lead) tin-lead solder is widely used for crea
Eutectic (63% tin-37% lead) or near-eutectic (40% tin-60% lead) tin-lead solder is widely used for crea
Externí odkaz:
http://hdl.handle.net/10150/611418
http://arizona.openrepository.com/arizona/handle/10150/611418
http://arizona.openrepository.com/arizona/handle/10150/611418
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:2314-2319
This article presents a simple approach for high-accuracy assembly of multiple ultrathin chips on flexible foil substrates. The chips are placed initially in the cavities on a chip carrier substrate and transferred onto a thermally releasable adhesiv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f719436040c4dc12381c92b131c3c4ae
https://doi.org/10.1109/tcpmt.2019.2938189
https://doi.org/10.1109/tcpmt.2019.2938189
Autor:
Johannes Partzsch, Olha Mudrievska, Karlheinz Bock, Jens Wagner, Martin C. Schubert, Laura Wambera, Krzysztof Nieweglowski, Christian Mayr, Frank Ellinger
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Suitable stretchable electronics is the key to promote future human-machine collaboration to facilitate processes in daily life. Sensors and actuators on humans will enable a close and yet unhesitating interaction with robots by translating data betw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::006d9546cfc5f9f99e2b3776306ab016
https://doi.org/10.1109/estc48849.2020.9229694
https://doi.org/10.1109/estc48849.2020.9229694
Autor:
Jean L. Sanders, F. Yalcin Yamaner, Omer Oralkan, Paul A. Dayton, Oluwafemi J. Adelegan, Isabel G. Newsome, Ali Onder Biliroglu
Publikováno v:
2020 IEEE International Ultrasonics Symposium (IUS).
Acoustic angiography (AA) has traditionally been limited by the lack of transducer arrays that are able to transmit at low (1–5 MHz) frequencies and also receive at high (>10 MHz) frequencies. We have designed and fabricated a 1D CMUT array capable
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c58aa807ab2913210dc0bb733c6c75d7
https://doi.org/10.1109/ius46767.2020.9251738
https://doi.org/10.1109/ius46767.2020.9251738
Autor:
Koji Terumoto, Toshikazu Mukai, Yoshiaki Oku, Ken Nakahara, Yoshinori Miyamae, Yosuke Nishida, Kazuisao Tsuruda
Publikováno v:
2020 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT).
The two types of practical plastic packages are proposed in this study for practical terahertz applications by using a plastic leaded chip carrier (PLCC), and also by embedding a parabolic antenna. A resonant tunneling diode (RTD) oscillator onto the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::182840faaa4b7d984eb4ffd0c3efed18
https://doi.org/10.1109/rfit49453.2020.9226224
https://doi.org/10.1109/rfit49453.2020.9226224
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
A new integrated power chip carrier based on high silicon aluminum alloy for high power microwave module is proposed. The film capacitance, RDL and eutectic layer are formed on the surface of high silicon aluminum alloy substrate by the fabrication p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3182770c89904d46834f92e84ad25347
https://doi.org/10.1109/icept50128.2020.9202922
https://doi.org/10.1109/icept50128.2020.9202922