Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Chinmay Nawghane"'
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c4aacd9a9af10f193d4b35885902064
https://doi.org/10.1109/eurosime56861.2023.10100821
https://doi.org/10.1109/eurosime56861.2023.10100821
Autor:
Bart Vandevelde, Marnix Van De Slyeke, Alexia Coulon, Chinmay Nawghane, Maarten Cauwe, Stan Heltzel
Publikováno v:
CEAS SPACE JOURNAL
Despite its introduction over 3 decades ago, designing, manufacturing and testing of high-density interconnect (HDI) printed circuit boards (PCBs) remains a topic of discussion. A plethora of advanced manufacturing processes is used to realize HDI PC
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fab89bee5af7496b95b0c3827c20ed4c
https://doi.org/10.1007/s12567-021-00403-2
https://doi.org/10.1007/s12567-021-00403-2
Autor:
Tim Stakenborg, Joren Raymenants, Ahmed Taher, Elisabeth Marchal, Bert Verbruggen, Sophie Roth, Ben Jones, Abdul Yurt, Wout Duthoo, Klaas Bombeke, Maarten Fauvart, Julien Verplanken, Rodrigo S. Wiederkehr, Aurelie Humbert, Chi Dang, Evi Vlassaks, Alejandra L. Jáuregui Uribe, Zhenxiang Luo, Chengxun Liu, Kirill Zinoviev, Riet Labie, Aduen Darriba Frederiks, Jelle Saldien, Kris Covens, Pieter Berden, Bert Schreurs, Joost Van Duppen, Rabea Hanifa, Megane Beuscart, Van Pham, Erik Emmen, Annelien Dewagtere, Ziduo Lin, Marco Peca, Youssef El Jerrari, Chinmay Nawghane, Chad Arnett, Andy Lambrechts, Paru Deshpande, Katrien Lagrou, Paul De Munter, Emmanuel André, Nik Van den Wijngaert, Peter Peumans
Publikováno v:
BIOSENSORS & BIOELECTRONICS
The SARS-CoV-2 pandemic has highlighted the need for improved technologies to help control the spread of contagious pathogens. While rapid point-of-need testing plays a key role in strategies to rapidly identify and isolate infectious patients, curre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8c06bc8c3cda6c91b6efc75157e2fc7f
https://biblio.vub.ac.be/vubir/molecular-detection-of-sarscov2-in-exhaled-breath-at-the-pointofneed(c79954a9-37f0-4fbd-8267-d5a402d3a05c).html
https://biblio.vub.ac.be/vubir/molecular-detection-of-sarscov2-in-exhaled-breath-at-the-pointofneed(c79954a9-37f0-4fbd-8267-d5a402d3a05c).html
Autor:
Bart Vandevelde, Chinmay Nawghane, Rainer Dudek, Ralf Doring, Jens Schindele, Przemyslaw Gromala
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5890fcacf82d6d5df6040a52b385e6c
https://doi.org/10.1109/eurosime54907.2022.9758850
https://doi.org/10.1109/eurosime54907.2022.9758850
ispartof: 2022 23RD INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME) ispartof: 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::74548b2275ff4a9ea476ba839082d802
https://lirias.kuleuven.be/handle/20.500.12942/704649
https://lirias.kuleuven.be/handle/20.500.12942/704649
Autor:
Tim Stakenborg, Joren Raymenants, Ahmed Taher, Elisabeth Marchal, Bert Verbruggen, Sophie Roth, Ben Jones, Abdul Yurt, Wout Duthoo, Klaas Bombeke, Maarten Fauvart, Julien Verplanken, Rodrigo Wiederkehr, Aurelie Humbert, Chi Dang, Evi Vlassaks, Alejandra Jauregui Uribe, Zhenxiang Luo, Chengxun Liu, Kirill Zinoviev, Riet Labie, Aduén Darriba Frederiks, Jelle Saldien, Kris Covens, Pieter Berden, Bert Schreurs, Joost Van Duppen, Rabea Hanifa, Megane Beuscart, Van Pham, Erik Emmen, Annelien Dewagtere, Ziduo Lin, Marco Peca, Youssef El Jerrari, Chinmay Nawghane, Chad Arnett, Andy Lambrechts, Paru Deshpande, Katrien Lagrou, Paul De Munter, Emmanuel André, Nik Van den Wijngaert, Peter Peumans
The SARS-CoV-2 pandemic has highlighted the need for improved technologies to help control the spread of contagious pathogens. While rapid point-of-need testing plays a key role in strategies to rapidly identify and isolate infectious patients, a cor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27ccd462d3f7d4516759c5a6f1ca330a
https://doi.org/10.21203/rs.3.rs-1104361/v1
https://doi.org/10.21203/rs.3.rs-1104361/v1
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
SnBi based solder alloys become an interesting alternative for standard SnAgCu as they can be used to solder components at much lower temperature. The typically 50°C lower solder reflow temperature is less damaging for PCB and components, and also p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2fac97b226e7de4521cf91806562b89a
https://doi.org/10.1115/ipack2021-73456
https://doi.org/10.1115/ipack2021-73456
Autor:
Riet Labie, Davy Pissoort, Jan Mehner, Ralph Lauwaert, Filip Vanhee, Chinmay Nawghane, Bart Allaert, Bart Vandevelde, Ingrid De Wolf
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
This paper is aimed at researching the impact of vibrations on chip scale packages (CSPs) assembled on a printed circuit board (PCB) and exploring finite element technique to investigate PCB assembly under vibration load. Importance of experimental m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4cd779f7d07692f21dfdcc3375f2e0e3
https://doi.org/10.1109/eurosime.2018.8369950
https://doi.org/10.1109/eurosime.2018.8369950