Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Ching-Yu Yeh"'
Publikováno v:
Buildings, Vol 11, Iss 9, p 415 (2021)
A shear tab and high-strength bolts are often used to connect a steel H-beam to a column. The design demand and capacity of these elements vary from one standard to the other. To investigate the effect, this study applied a finite element method (FEM
Externí odkaz:
https://doaj.org/article/343cd8226eaa42feace8c7cd0e038774
Autor:
Chia-Hung Lee, Erh-Ju Lin, Jyun-Yang Wang, Yi-Xuan Lin, Chen-Yu Wu, Chung-Yu Chiu, Ching-Yu Yeh, Bo-Rong Huang, Kuan-Lin Fu, Cheng-Yi Liu
Publikováno v:
Nanomaterials, Vol 11, Iss 7, p 1630 (2021)
Tensile tests were carried on the electroplated Cu films with various densities of twin grain boundary. With TEM images and a selected area diffraction pattern, nano-twinned structure can be observed and defined in the electroplated Cu films. The den
Externí odkaz:
https://doaj.org/article/890066b2ded346778f4a399fb5dd9352
Autor:
Ching-yu Yeh, 葉靜瑜
96
The study was designed based on broaden-and-build theory which suggests: the positive emotions not only broaden an individual’s momentary thought–action repertoire, but undo lingering negative. Furthermore, the positive emotion fuel psych
The study was designed based on broaden-and-build theory which suggests: the positive emotions not only broaden an individual’s momentary thought–action repertoire, but undo lingering negative. Furthermore, the positive emotion fuel psych
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/87923928815842113311
Autor:
Ching-Yu Yeh, 葉青瑜
87
Pig blood was centrifuged to separate the plasma and blood cell. Blood cell was decolorized by treatment with sodium pectate and gave globin that was then modified by heating and treating with pectin. Both the plasma and modified globin were
Pig blood was centrifuged to separate the plasma and blood cell. Blood cell was decolorized by treatment with sodium pectate and gave globin that was then modified by heating and treating with pectin. Both the plasma and modified globin were
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/85717353329539030384
Autor:
Chia Hung Lee, J. S. Chang, Y. X. Lin, C. Y. Wu, J. Y. Wang, C. Y. Chen, T. H. Yen, Chung Yu Chiu, Ching Yu Yeh, Cheng Yi Liu, Bo Rong Huang, Kuan Lin Fu
Publikováno v:
Journal of Electronic Materials. 50:6584-6589
The present work investigated the effect of Ag additives on the consumption of cathode Cu pad under electromigration in a current-stressed Cu/Sn3.5Ag/Cu flip-chip structure. The consumption rate of a cathode Cu pad in a pure Sn system is faster than
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8bad0bda752755a0c811dc6f148047f0
https://doi.org/10.1007/s11664-021-09234-7
https://doi.org/10.1007/s11664-021-09234-7
Autor:
C. Y. Wu, Cheng Yi Liu, Bo Rong Huang, Kuan Lin Fu, Chia Hung Lee, Y. X. Lin, Ching Yu Yeh, J. S. Chang, Chung Yu Chiu, J. Y. Wang
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:18605-18615
Typically, Sn cannot be finished on Ni and Ag surfaces via the immersion process. In this work, through galvanic reaction, immersion Sn finish was processed on an immersion Ag finish coexisting with a Ni surface. Herein, the detailed mechanism of the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0df18f1cbf88d540d62aeabb3e9b5579
https://doi.org/10.1007/s10854-021-06306-6
https://doi.org/10.1007/s10854-021-06306-6
Autor:
Chia Hung Lee, C. Y. Wu, Y. X. Lin, Chung Yu Chiu, J. Y. Wang, Cheng Yi Liu, Bo Rong Huang, Ching Yu Yeh
Publikováno v:
Journal of the American Ceramic Society. 104:1707-1715
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74e5596b04597ab947bb95348ccea966
https://doi.org/10.1111/jace.17586
https://doi.org/10.1111/jace.17586
Autor:
Y. X. Lin, J. Y. Wang, E. J. Lin, Ching Yu Yeh, Pai Jung Chang, Chung Yu Chiu, C. Y. Wu, Cheng Yi Liu, Chia Hung Lee
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:567-576
The effect of Ag solutes on the solid-state Cu dissolution in the Sn3.5Ag solder was studied. The solid-state Cu dissolution depends on the dissolution of the interfacial Cu6Sn5 compound layer, which is constant with time. In a low annealing temperat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da5cacd0ed1c1b62aca15008551f6801
https://doi.org/10.1007/s10854-020-04839-w
https://doi.org/10.1007/s10854-020-04839-w
Autor:
Chia Yueh Chou, Wei Hao Chen, Ching Yu Yeh, Mao Feng Hsu, Bao Jhen Li, Cheng Yi Liu, Bo Rong Huang, Sheng Feng Chung
Publikováno v:
Journal of Electronic Materials. 50:779-785
The conductive and transparent properties of ZnO/Cu/ZnO sandwich structures were investigated in this study. The I–V curves of single ZnO films with different thicknesses were recorded and plotted. The linear I–V curves confirmed the ohmic conduc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b2801261a477f2c846d615508d6e2b3
https://doi.org/10.1007/s11664-020-08471-6
https://doi.org/10.1007/s11664-020-08471-6
Autor:
M. L. Cheng, Cheng Yi Liu, J. Y. Wang, C. Y. Hsiao, W. X. Zhuang, A. L. Liu, Ching Yu Yeh, Y. K. Tang, Y. H. Chen, C. Y. Wu, E. J. Lin, Chia Hung Lee, Chung Yu Chiu, Y. X. Lin
Publikováno v:
Journal of Electronic Materials. 49:26-33
In this work, the effect of the chemical additives (surfactant, stabilizer) on the corrosion resistance of the Ni(P) layer was investigated. The average O content at the depth of 1 nm of the tested Ni(P) specimens was used as the indication of the co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7accd7a09f77b2907d3217a3897a29b
https://doi.org/10.1007/s11664-019-07626-4
https://doi.org/10.1007/s11664-019-07626-4