Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Ching-Shun Huang"'
Autor:
Gin-Rong Liu, Chung-Chih Liu, Ching-Shun Huang, Tang-Huang Lin, Wann-Jin Chen, Chun-Chieh Chao
Publikováno v:
Terrestrial, Atmospheric and Oceanic Sciences, Vol 21, Iss 5, p 807 (2010)
Surprisingly, on 27 December 2001, a storm named Typhoon Vamei formed near in Singaporean waters. An examination on the SSM/I-derived rainfall rates and air-sea parameters showed that significant higher latent heat release and air-sea energy flux dur
Externí odkaz:
https://doaj.org/article/0ecdf73435f34c779771161b5cd3469e
Autor:
Ching-Shun Huang, 黃慶順
91
This thesis presents a scheme for agents, mobile or stationary, to carry updated ontology in DARPA Agent Markup Language (DAML) so that agents can communicate with each other in a precise, stable, and secure way. Furthermore, agents can acces
This thesis presents a scheme for agents, mobile or stationary, to carry updated ontology in DARPA Agent Markup Language (DAML) so that agents can communicate with each other in a precise, stable, and secure way. Furthermore, agents can acces
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/29389005254531398421
Autor:
Ching-Shun Huang, 黃清舜
91
The development trend of electronic product is toward lighter, thinner, smaller, and high density. The wafer level packages meet both the trend and low cost requirement. The wafer level packages get popular in market. One critical issue of wa
The development trend of electronic product is toward lighter, thinner, smaller, and high density. The wafer level packages meet both the trend and low cost requirement. The wafer level packages get popular in market. One critical issue of wa
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/64180104266035035929
Autor:
Ching-Shun Huang, 黃景舜
90
Since established in 1915, Kinmen County has been transformed its governance into three different phases. First, in 1965 coping military threats with Communist China, Executive Yuan of Taiwanese government issued proxy regulations so-called b
Since established in 1915, Kinmen County has been transformed its governance into three different phases. First, in 1965 coping military threats with Communist China, Executive Yuan of Taiwanese government issued proxy regulations so-called b
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/76429417287874218776
Publikováno v:
Composites Science and Technology. 52:407-416
The crystallization behavior of poly(ether ether ketone) (PEEK) under pressures from 0·1 to 200 MPa has been studied by using a tubular oven or hot isostatic pressing. The DSC results and SEM observations show that high pressure will enhance the for
Autor:
Mars Tsai, Wen-Kung Yang, Chung-Jung Wu, Dyi-Chung Hu, Kuo-Ning Chiang, Ching-Shun Huang, Ming-Chih Yew
Publikováno v:
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
The wafer level package (WLP) is a cost-effective solution for the electronic package, and has been increasingly applied during recent years. In this study, a new packaging technology developed based on the concepts of the WLP, the panel base package
Autor:
Wen-Kun Yang, Ching-Shun Huang, Mon-Chin Tsai, Chan-Yen Chou, Tuan-Yu Hung, Ming-Chih Yew, Kuo-Ning Chiang, Dyi-Chung Hu
Publikováno v:
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
In this research, the objective is to develop a stress-buffer-enhanced package subjected to board level drop test under a high-G impact drop; both drop test experiments and ANSYS/LS-DYNA simulations are executed. Many researchers indicate that solder
A Study of Failure Mechanism and Reliability Assessment for the Panel Level Package (PLP) Technology
Publikováno v:
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
In this study, a new packaging technology, chip-on-metal (COM) panel level package (PLP), is proposed to resolve the problem of assembling a fine-pitched chip to a coarse-pitched substrate. During the manufacturing process, the filler polymer materia
Autor:
Ming-Chih Yew, Chun-Hui Yu, Ching-Shun Huang, Chin-Cheng Yang, Wen-Kung Yang, Kou-Ning Chiang, C.Y. Chou, G.Q. Zhang, Cadmus Yuan
Publikováno v:
7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
A novel wafer level chip scaled packaging (WLCSP) having the capability of the redistributing the electrical circuit is proposed herein to resolve the problem of assembling a fine pitched chip to a coarse pitched substrate. In the fan-out WLCSP, the