Zobrazeno 1 - 10
of 1 219
pro vyhledávání: '"Ching-Ping Wong"'
Autor:
Yun Chen, Yuanhui Guo, Bin Xie, Fujun Jin, Li Ma, Hao Zhang, Yihao Li, Xin Chen, Maoxiang Hou, Jian Gao, Huilong Liu, Yu-Jing Lu, Ching-Ping Wong, Ni Zhao
Publikováno v:
Nature Communications, Vol 15, Iss 1, Pp 1-9 (2024)
Abstract Millirobots must have low cost, efficient locomotion, and the ability to track target trajectories precisely if they are to be widely deployed. With current materials and fabrication methods, achieving all of these features in one millirobot
Externí odkaz:
https://doaj.org/article/a2cde2224a6041f1a0971a9d547b5446
Autor:
Gang Jian, Shangtao Zhu, Xiao Yuan, Shengqiao Fu, Ning Yang, Chao Yan, Xu Wang, Ching-Ping Wong
Publikováno v:
NPG Asia Materials, Vol 16, Iss 1, Pp 1-11 (2024)
Abstract Implantable medical devices have played an important role in human medicine in recent decades. However, traditional implanted devices require battery replacement and a second surgery for device removal, which can cause pain to the patient. T
Externí odkaz:
https://doaj.org/article/a291dcf7f1dc4126a66f844fda8b2aa6
Autor:
Fei Zhu, Gang Lian, Deliang Cui, Qilong Wang, Haohai Yu, Huaijin Zhang, Qingbo Meng, Ching-Ping Wong
Publikováno v:
Nano-Micro Letters, Vol 15, Iss 1, Pp 1-13 (2023)
Highlights Uniaxial orientation and single-grain penetration of quasi-2D and 3D perovskite films were achieved via a general thermal-pressed (TP) strategy. The TP-perovskite-based self-powered photodetectors (SPPDs) exhibit one of the best results am
Externí odkaz:
https://doaj.org/article/84e1b17b94f44582becb48c6aa2929c7
Autor:
Fukang Deng, Jianhong Wei, Yadong Xu, Zhiqiang Lin, Xi Lu, Yan-Jun Wan, Rong Sun, Ching-Ping Wong, Yougen Hu
Publikováno v:
Nano-Micro Letters, Vol 15, Iss 1, Pp 1-15 (2023)
Highlights A flexible freestanding TaS2 film (thickness = 3.1 μm) exhibits an ultralow void ratio of 6.01%, an ultra-high electrical conductivity of 2,666 S cm−1, an electromagnetic interference shielding effectiveness (EMI SE) of 41.8 dB, an abso
Externí odkaz:
https://doaj.org/article/7b07bcb225ba41c9950ded38b931b26b
Autor:
Fuqiang Xie, Junling Xu, Qizhong Liao, Qingqing Zhang, Binyun Liu, Lianyi Shao, Junjie Cai, Xiaoyan Shi, Zhipeng Sun, Ching-Ping Wong
Publikováno v:
Energy Reviews, Vol 2, Iss 2, Pp 100027- (2023)
With the increasing popularity of electric/hybrid vehicles and the rapid development of 3C electronics, there is a growing interest in high-rate energy storage systems. The rapid development and widespread adoption of lithium-ion batteries (LIBs) can
Externí odkaz:
https://doaj.org/article/4d07953fa54c4ece90ea3d32cd148447
Autor:
Yadong Xu, Zhiqiang Lin, Krishnamoorthy Rajavel, Tao Zhao, Pengli Zhu, Yougen Hu, Rong Sun, Ching-Ping Wong
Publikováno v:
Nano-Micro Letters, Vol 14, Iss 1, Pp 1-15 (2021)
Highlights A confined thermal expansion strategy to fabricate liquid metal (LM)-based monoliths with continuous LM network at ultra-low content. The results show a strong integration advantage of LM-based monoliths in density, mechanical strength, el
Externí odkaz:
https://doaj.org/article/de45fbaed7bd42cbabd7b6a55de2480a
Autor:
Xiaona Wang, Zhenyu Zhou, Zhijian Sun, Jinho Hah, Yagang Yao, Kyoung-Sik Moon, Jiangtao Di, Qingwen Li, Ching-ping Wong
Publikováno v:
Nano-Micro Letters, Vol 13, Iss 1, Pp 1-12 (2020)
Abstract Coaxial fiber-shaped supercapacitors are a promising class of energy storage devices requiring high performance for flexible and miniature electronic devices. Yet, they are still struggling from inferior energy density, which comes from the
Externí odkaz:
https://doaj.org/article/8c1eacd86f3444a1967b38852cf2a16d
Autor:
Longquan Ma, Xuecheng Yu, Yuanyuan Yang, Yougen Hu, Xinyu Zhang, Huayuan Li, Xing Ouyang, Pengli Zhu, Rong Sun, Ching-ping Wong
Publikováno v:
Journal of Materiomics, Vol 6, Iss 2, Pp 321-329 (2020)
With the continuous development of wearable electronics, health care and smart terminals, highly performance flexible pressure sensors present a huge application prospect. In this study, by introducing the micro-array structured electrodes and dielec
Externí odkaz:
https://doaj.org/article/f5f7561974424beea1f0783cd0ac50fd
Autor:
Yun Chen, Shuquan Ding, Junyu Long, Maoxiang Hou, Xin Chen, Jian Gao, Yunbo He, Ching-Ping Wong
Publikováno v:
IEEE Access, Vol 8, Pp 206571-206580 (2020)
The increasing miniaturization of functional devices drives the microelectronic industry to pursuit large-span-ratio and high-density wire bonding packaging technology as it can facilely interconnect various chips at a low cost. The design method of
Externí odkaz:
https://doaj.org/article/b856b30ad9b045d483ce737de4bfc240
Autor:
Wen Dai, Le Lv, Tengfei Ma, Xiangze Wang, Junfeng Ying, Qingwei Yan, Xue Tan, Jingyao Gao, Chen Xue, Jinhong Yu, Yagang Yao, Qiuping Wei, Rong Sun, Yan Wang, Te‐Huan Liu, Tao Chen, Rong Xiang, Nan Jiang, Qunji Xue, Ching‐Ping Wong, Shigeo Maruyama, Cheng‐Te Lin
Publikováno v:
Advanced Science, Vol 8, Iss 7, Pp n/a-n/a (2021)
Abstract Graphene is usually embedded into polymer matrices for the development of thermally conductive composites, preferably forming an interconnected and anisotropic framework. Currently, the directional self‐assembly of exfoliated graphene shee
Externí odkaz:
https://doaj.org/article/61184df3354349548639c546385edda9