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pro vyhledávání: '"Ching-MuLin"'
Autor:
Ching-MuLin, 林青穆
107
In this paper, the finite element software ANSYS is used to analyze the mechanical dynamic behavior of the extra thin QFN electronic packages in the test handler and the test socket. The simulation results of the ANSYS is used to match actua
In this paper, the finite element software ANSYS is used to analyze the mechanical dynamic behavior of the extra thin QFN electronic packages in the test handler and the test socket. The simulation results of the ANSYS is used to match actua
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/q348wz
