Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Ching-Ming Ku"'
Autor:
Ching-Ming Ku, Stone Cheng
Publikováno v:
Applied Sciences, Vol 12, Iss 11, p 5684 (2022)
During the oxide layer etching process, particles in capacitively coupled plasma etching equipment adhere to the wafer edge and cause defects that reduce the yield from semiconductor wafers. To reduce edge particle contamination in plasma etching equ
Externí odkaz:
https://doaj.org/article/ae9a595a4d1d4ed28f549b6f017213a6
Autor:
Ching-Ming Kuo, 郭慶明
93
Nowadays, many people have to sit on office chair for a long time in their office hours. Because of inappropriate using of office chairs, they often got injuries and became inefficient in work. Although many designers created some devises for
Nowadays, many people have to sit on office chair for a long time in their office hours. Because of inappropriate using of office chairs, they often got injuries and became inefficient in work. Although many designers created some devises for
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/3ay2hs
Autor:
Ching Ming Ku, 古景銘
98
This paper aims to study three-dimensional integrated circuits in silicon vias technology, dry etching process. And to explore how to enhance the silicon wafer etch rate and etching process of stability and uniformity, and to identify the sil
This paper aims to study three-dimensional integrated circuits in silicon vias technology, dry etching process. And to explore how to enhance the silicon wafer etch rate and etching process of stability and uniformity, and to identify the sil
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/13821310674341396100