Zobrazeno 1 - 10
of 50
pro vyhledávání: '"Ching-Kuan Lee"'
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 21:96-101
In recent years, the use of fan-out packaging solutions has boomed in semiconductor-related fields. There are primarily two versions used for mass production: wafer level and panel level. In this research, a glass substrate was used in the design of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a823b3957b9f93b0f201a541c513d042
https://doi.org/10.1109/tdmr.2021.3056054
https://doi.org/10.1109/tdmr.2021.3056054
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 9:E16-009
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::487fcd3107ae933c94d1a07db7aefffe
https://doi.org/10.5104/jiepeng.9.e16-009-1
https://doi.org/10.5104/jiepeng.9.e16-009-1
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
In this paper, we investigate antenna on glass and compare the property with antenna on ceramic substrate at 60GHz band for Wireless Gigabit alliance application. The design of Antenna on Corning EAGLE XG Glass is dependent on the result of simulatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::146ac2751eada27c7a2aed86ce2281df
https://doi.org/10.23919/icep.2018.8374697
https://doi.org/10.23919/icep.2018.8374697
Autor:
Yu-Mei Cheng, Ren-Shing Cheng, Li-Ling Liao, Jui-Feng Hung, Yu-Lin Chao, Ra-Min Tain, Ming-Ji Dai, Yu-Wei Huang, Heng-Chieh Chien, Chun-Hsien Chien, Wei-Chung Lo, Chau-Jie Zhan, Ching-Kuan Lee, Ming-Jer Kao, Sheng-Tsai Wu, John H. Lau
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:1407-1419
In this investigation, a system-in-package (SiP) that consists of a very low-cost interposer with through-silicon holes (TSHs) and with chips on its top and bottom sides (a real 3-D IC integration) is studied. Emphasis is placed on the fabrication of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4899c0a43489c421c7a9a17198bae8a
https://doi.org/10.1109/tcpmt.2014.2339832
https://doi.org/10.1109/tcpmt.2014.2339832
Publikováno v:
Journal of the Chinese Chemical Society. 60:745-754
The synthesis and characterization for a series of symmetrical 1,3-dialkylimidazolium salts with different chain lengths and counter anions together with their 1-alkylimidazole precursors are described. Liquid crystal (LC) properties of these salts a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa794012ec5a2322262c7c729892d8f4
https://doi.org/10.1002/jccs.201200598
https://doi.org/10.1002/jccs.201200598
Autor:
Kuo-Chyuan Chen, Hsiang-Hung Chang, Yuan-Chang Lee, Ching-Kuan Lee, Yung Jean Rachel Lu, Jen-Chun Wang, Chia-Wen Fan, Wen-Wei Shen, Huan-Chun Fu, Chau-Jie Zhan
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In this paper, we investigate reliability testing for a glass interposer. The test vehicle is an assembled glass interposer with a chip, a BT substrate. The structure of a glass interposer with two redistribution layers (RDLs) on the front-side and o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13274814741472ba8d69ee6216ec234c
https://doi.org/10.1109/impact.2016.7800011
https://doi.org/10.1109/impact.2016.7800011
Autor:
Yu-Min Lin, Chia-Wen Fan, Chau-Jie Zhan, Wen-Wei Shen, Huan-Chun Fu, Su-Ching Chung, Su-Mei Chen, Chia-Wen Chiang, Jen-Chun Wang, Wei-Chung Lo, Hsiang-Hung Chang, Yuan-Chang Lee, Ching-Kuan Lee, Yung Jean Lu
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
In this paper, we investigated the reliability test for Glass interposer. The test vehicle is assembled glass interposer with chip, BT substrate, and PCB. The structure of a glass interposer with two RDL on the front-side and one RDL on the backside
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::898d8169fccb5afa005ad60b72aab4ca
https://doi.org/10.1109/icep.2016.7486780
https://doi.org/10.1109/icep.2016.7486780
Autor:
Yu-Lan Lu, Jui-Hsiung Huang, Ming-Jer Kao, Cheng-Ta Ko, Huan-Chun Fu, Ching-Kuan Lee, Robert Lo, Ren-Shin Cheng, Zhi-Cheng Hsiao, Kuo-Shu Kao, John H. Lau, Pei-Chen Chang, Yu-Jiau Huang, Tao-Chih Chang
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:1229-1238
In this investigation, Cu-Sn lead-free solder microbumps on 10-μm pads with a 20-μm pitch are designed and fabricated. The chip size is 5 × 5 mm with thousands of microbumps. A daisy-chain feature is adopted for the characterization and reliabilit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2ecd2b50efcb192420ae9abf594659b
https://doi.org/10.1109/tcpmt.2012.2189397
https://doi.org/10.1109/tcpmt.2012.2189397
Autor:
Jui-Chin Chen, Shang-Chun Chen, Peng Su, Chien-Ying Wu, Li Li, Pei-Jer Tzeng, M. Brillhart, Jie Xue, Yu-Chen Hsin, Ming-Ji Dai, Ching-Kuan Lee, John H. Lau, Chau-Jie Zhan
Publikováno v:
International Symposium on Microelectronics. 2012:001209-001214
The feasibility study of a 3D IC integration SiP is demonstrated in this investigation. The heart of this SiP is a TSV (through-silicon via) passive interposer (28mm × 28mm) with double sided wiring layers. This interposer is used to support a very
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7c0ef80ec5600621593875a6e73c6f2
https://doi.org/10.4071/isom-2012-thp61
https://doi.org/10.4071/isom-2012-thp61
Autor:
Su-Mei Chen, Yu-Min Lin, Huan-Chun Fu, Yung Jean Lu, Chia-Wen Fan, Jen-Chun Wang, C. W. Chiang, Wei-Chung Lo, Yuan-Chang Lee, Ching-Kuan Lee, Chau-Jie Zhan, Wen-Wei Shen, Su-Ching Chung
Publikováno v:
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In this paper, we investigated the assembly characterization for reliability test. The structure of a glass interposer with two RDL on the front-side and one RDL on the backside had been evaluated and developed. Key technologies, including via fabric
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6283e5d1c3239395f0435922865a4741
https://doi.org/10.1109/impact.2015.7365220
https://doi.org/10.1109/impact.2015.7365220