Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Ching-Chia Chen"'
Autor:
Ching-chia Chen, 陳敬家
104
Over the past decades, the economic growth trends between cross-strait has shown the opposite. China has taken a place among the great power of economy. On the other hand, Taiwan has faced with the slowing growth of economy, higher unemploym
Over the past decades, the economic growth trends between cross-strait has shown the opposite. China has taken a place among the great power of economy. On the other hand, Taiwan has faced with the slowing growth of economy, higher unemploym
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/61106854878776071155
Autor:
Ching-Chia Chen, 陳靖佳
104
Cabbage (Brassica oleracea L. var. capitata L.) and rice (Oryza sativa L.) are the important crops grown worldwide, and also has been the most widely cultivated crops in Taiwan. Traditional breeding methods have been making remarkable progre
Cabbage (Brassica oleracea L. var. capitata L.) and rice (Oryza sativa L.) are the important crops grown worldwide, and also has been the most widely cultivated crops in Taiwan. Traditional breeding methods have been making remarkable progre
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/57462886936213785951
Autor:
Ching-Chia Chen, 陳敬家
101
Water treatment processes are adapted prior to distribution to ensure supply of safe drinking water. In recent years, however, drinking water has been identified to contain harmful chemicals such as aluminum that when ingested causes adverse
Water treatment processes are adapted prior to distribution to ensure supply of safe drinking water. In recent years, however, drinking water has been identified to contain harmful chemicals such as aluminum that when ingested causes adverse
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/15801512141144950566
Autor:
Ching-Chia Chen, Wen-Yu Teng, Fang Lin Tsai, Jackson Lee, Liang Yih Hung, Don Son Jiang, Yu-Po Wang
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e5d86c27b5b0d76196804ff9da5535b
https://doi.org/10.1109/eptc56328.2022.10013253
https://doi.org/10.1109/eptc56328.2022.10013253
Autor:
Jakovljević Mihajlo B., Tetsuji Yamada, Ching Chia Chen, Stevanović Dejan S., Jovanović Mirjana R., Nikić-Đuričić Katarina D., Rančić Nemanja K., Savić Dejana M., Biorac Nenad M., Mihajlović Goran S., Janković Slobodan M.
Publikováno v:
Hospital Pharmacology, Vol 2, Iss 1, Pp 235-245 (2015)
Background and Objectives There is a paucity of published cost-effectiveness studies of alternative scenarios in depressive episode acute medical care in Eastern European populations. Methods Prospective cost-effectiveness analysis was conducted on 6
Externí odkaz:
https://doaj.org/article/bf18e8817afe4809a88259652b34ee37
Autor:
Ji-Rong Chen, T. Y. Kuo, Cheng-Hsin Chuang, Ching-Chia Chen, Yi-Chin Chou, Hua-Cheng Chiang, Kei Ameyama, Muhammad Omar Shaikh
Publikováno v:
Rapid Prototyping Journal. 26:473-483
Purpose Using wire as feedstock has several advantages for additive manufacturing (AM) of metal components, which include high deposition rates, efficient material use and low material costs. While the feasibility of wire-feed AM has been demonstrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::359f5e393c5b9aebfc8c328f038c9fd1
https://doi.org/10.1108/rpj-04-2019-0110
https://doi.org/10.1108/rpj-04-2019-0110
Publikováno v:
International Symposium on Microelectronics. 2019:000323-000326
As consumer and portable devices get thinner and more functionality. Chips which are made by less than 28 nm node wafer with extreme Low-k (ELK) inter metal dielectric material is a trend in order to contain more transistors and to lower power consum
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f956968a9f96dfeff038aa4d9acace7
https://doi.org/10.4071/2380-4505-2019.1.000323
https://doi.org/10.4071/2380-4505-2019.1.000323
Publikováno v:
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
With die size increasing and bump pitch decreasing on FCBGA (flip chip ball grid array), warpage is the first challenge that processes of package assembly and SMT (surface mount technology) will have. The main factor is CTE (coefficient of thermal ex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05216203b9c110c268bbe8cb5cd8f08b
https://doi.org/10.1115/ipack2020-2547
https://doi.org/10.1115/ipack2020-2547
Autor:
Wing Shing Wong, Wing C. Kwong, Ching-Chia Chen, Guu-Chang Yang, Jing-Shiuan Lin, Min-Kuan Chang
Publikováno v:
IEEE Transactions on Communications. 64:4736-4748
Protocol sequences have recently been studied in collision channels without feedback for dynamic multiple-access mobile applications, such as wireless sensor and vehicular ad hoc networks. In this paper, a method of systematically adding mark chips i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3277ba99d5850532d79c9718cf49b37e
https://doi.org/10.1109/tcomm.2016.2606621
https://doi.org/10.1109/tcomm.2016.2606621