Zobrazeno 1 - 10
of 52
pro vyhledávání: '"Ching En Lee"'
Publikováno v:
IEEE Journal of Solid-State Circuits. 57:3490-3502
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97b1ace323cfc3d3d150dca0b79ee633
https://doi.org/10.1109/jssc.2022.3169946
https://doi.org/10.1109/jssc.2022.3169946
Autor:
Ching-En Lee, Chester Liu, Jie-Fang Zhang, Zhengya Zhang, Yakun Sophia Shao, Stephen W. Keckler
Publikováno v:
IEEE Journal of Solid-State Circuits. 56:636-647
Recent developments in deep neural network (DNN) pruning introduces data sparsity to enable deep learning applications to run more efficiently on resource- and energy-constrained hardware platforms. However, these sparse models require specialized ha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2d898d37c53548689c6b54bd0bd1e29
https://doi.org/10.1109/jssc.2020.3043870
https://doi.org/10.1109/jssc.2020.3043870
Autor:
Wen-Ching Chiu, Ming-Yang Deng, Li-Wei Shih, Ching-En Lee, Jui-Hung Chang, Chih-Lung Lin, Yu-Sheng Lin
Publikováno v:
IEEE Transactions on Industrial Electronics. 67:7015-7024
A new pre-bootstrapping method (PBM) using hydrogenated amorphous silicon (a-Si:H) thin-film transistors (TFTs) for a gate driver that is used in high-frame-rate or high-resolution displays is presented in this article. The PBM utilizes the capacitiv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39dd94e3d057415d758366bb953dc1f8
https://doi.org/10.1109/tie.2019.2940000
https://doi.org/10.1109/tie.2019.2940000
Publikováno v:
IEEE Journal of Solid-State Circuits. 54:2081-2090
An inference system-on-chip (SoC) is designed to extract spatio-temporal features from videos for action classification. The SoC contains an inference core that implements a recurrent neural network in three processing layers. High sparsity is enforc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7333103a8623aadfa1d2091f86af5a60
https://doi.org/10.1109/jssc.2019.2907406
https://doi.org/10.1109/jssc.2019.2907406
Autor:
Lisa N. Kinch, Nick V. Grishin, Ching En Lee, Jingcheng Wang, Bray Denard, Jin Ye, Elina Esmaeilzadeh Gharehdaghi
Publikováno v:
Journal of Biological Chemistry. 294:6054-6061
Adopting a proper topology is crucial for transmembrane proteins to perform their functions. We previously reported that ceramide regulates a transmembrane protein called TM4SF20 (transmembrane 4 L six family member 20) through topological inversion
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5c6306f1b2d61c0583b26087824bd63a
https://doi.org/10.1074/jbc.ra119.007681
https://doi.org/10.1074/jbc.ra119.007681
Autor:
Giin-Shan Chen, Ching-En Lee, Yi-Lung Cheng, Jau-Shiung Fang, Chien-Nan Hsiao, Wei-Chun Chen, Yiu-Hsiang Chang, Yen-Chang Pan, Wei Lee, Ting-Hsun Su
Publikováno v:
Journal of The Electrochemical Society. 169:082519
The downsizing of integrated circuits for the upcoming technology nodes has brought attention to sub-2 nm thin organic/inorganic materials as an alternative to metallic barrier/capping layers for nanoscaled Cu interconnects. While self-assembled mono
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b37e300e8b1a395e2a6746921c237cb5
https://doi.org/10.1149/1945-7111/ac89b8
https://doi.org/10.1149/1945-7111/ac89b8
Publikováno v:
PLoS ONE, Vol 9, Iss 10, p e108528 (2014)
CREB3L1 (cAMP response element binding protein 3-like 1), a transcription factor synthesized as a membrane-bound precursor and activated through Regulated Intramembrane Proteolysis (RIP), is essential for collagen production by osteoblasts during bon
Externí odkaz:
https://doaj.org/article/8adbf80cb35a400ebdc815c92ce9351f
Publikováno v:
VLSI Circuits
VOTA is a domain-specific accelerator for correlation filter (CF)-based visual object tracking (VOT). It encompasses a Winograd convolution core, a FFT core and a vector core in a high-bandwidth starring topology. VOTA’s frame-based instructions an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cfa4aca1de31a6fc3ac04b7de81c3d78
https://doi.org/10.23919/vlsicircuits52068.2021.9492379
https://doi.org/10.23919/vlsicircuits52068.2021.9492379
Publikováno v:
Materials Letters. 304:130718
The continued downscaling of integrated circuits has brought into focus the development of new molecularly thick barrier/capping materials and novel fabrication processes for Cu interconnects with gradually diminished lateral dimensions. Here, an all
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::826c41a6e2b63734fe26ff86e1111259
https://doi.org/10.1016/j.matlet.2021.130718
https://doi.org/10.1016/j.matlet.2021.130718