Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Ching Chia Chen"'
Autor:
Jakovljević Mihajlo B., Tetsuji Yamada, Ching Chia Chen, Stevanović Dejan S., Jovanović Mirjana R., Nikić-Đuričić Katarina D., Rančić Nemanja K., Savić Dejana M., Biorac Nenad M., Mihajlović Goran S., Janković Slobodan M.
Publikováno v:
Hospital Pharmacology, Vol 2, Iss 1, Pp 235-245 (2015)
Background and Objectives There is a paucity of published cost-effectiveness studies of alternative scenarios in depressive episode acute medical care in Eastern European populations. Methods Prospective cost-effectiveness analysis was conducted on 6
Externí odkaz:
https://doaj.org/article/bf18e8817afe4809a88259652b34ee37
Autor:
Ching-Chia Chen, Wen-Yu Teng, Fang Lin Tsai, Jackson Lee, Liang Yih Hung, Don Son Jiang, Yu-Po Wang
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Autor:
Ji-Rong Chen, T. Y. Kuo, Cheng-Hsin Chuang, Ching-Chia Chen, Yi-Chin Chou, Hua-Cheng Chiang, Kei Ameyama, Muhammad Omar Shaikh
Publikováno v:
Rapid Prototyping Journal. 26:473-483
Purpose Using wire as feedstock has several advantages for additive manufacturing (AM) of metal components, which include high deposition rates, efficient material use and low material costs. While the feasibility of wire-feed AM has been demonstrate
Publikováno v:
International Symposium on Microelectronics. 2019:000323-000326
As consumer and portable devices get thinner and more functionality. Chips which are made by less than 28 nm node wafer with extreme Low-k (ELK) inter metal dielectric material is a trend in order to contain more transistors and to lower power consum
Publikováno v:
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
With die size increasing and bump pitch decreasing on FCBGA (flip chip ball grid array), warpage is the first challenge that processes of package assembly and SMT (surface mount technology) will have. The main factor is CTE (coefficient of thermal ex
Autor:
Wing Shing Wong, Wing C. Kwong, Ching-Chia Chen, Guu-Chang Yang, Jing-Shiuan Lin, Min-Kuan Chang
Publikováno v:
IEEE Transactions on Communications. 64:4736-4748
Protocol sequences have recently been studied in collision channels without feedback for dynamic multiple-access mobile applications, such as wireless sensor and vehicular ad hoc networks. In this paper, a method of systematically adding mark chips i
Autor:
Ching-chia Chen, 陳敬家
104
Over the past decades, the economic growth trends between cross-strait has shown the opposite. China has taken a place among the great power of economy. On the other hand, Taiwan has faced with the slowing growth of economy, higher unemploym
Over the past decades, the economic growth trends between cross-strait has shown the opposite. China has taken a place among the great power of economy. On the other hand, Taiwan has faced with the slowing growth of economy, higher unemploym
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/61106854878776071155
Autor:
Ching-Chia Chen, 陳靖佳
104
Cabbage (Brassica oleracea L. var. capitata L.) and rice (Oryza sativa L.) are the important crops grown worldwide, and also has been the most widely cultivated crops in Taiwan. Traditional breeding methods have been making remarkable progre
Cabbage (Brassica oleracea L. var. capitata L.) and rice (Oryza sativa L.) are the important crops grown worldwide, and also has been the most widely cultivated crops in Taiwan. Traditional breeding methods have been making remarkable progre
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/57462886936213785951