Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Chinami Marushima"'
Publikováno v:
IEEE Photonics Journal, Vol 10, Iss 6, Pp 1-8 (2018)
We demonstrate the design and fabrication of a mode (de)multiplexer based on the tapered mode-selective coupler. The proposed device is directly inscribed in the substrate material by a needle-type liquid micro-dispenser and a three-axis robot stage
Externí odkaz:
https://doaj.org/article/e7281db0d2624c6db5e94bda1cc2c792
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bff286f791d2dd4b2ef81cc23e2735d9
https://doi.org/10.23919/icep55381.2022.9795419
https://doi.org/10.23919/icep55381.2022.9795419
Autor:
Akihiro Horibe, Takahito Watanabe, Chinami Marushima, Hiroyuki Mori, Sayuri Kohara, Roy Yu, Marc Bergendahl, Teddie Magbitang, Rudy Wojtecki, Divya Taneja, Maxime Godard, Claudia Cristina Barrera Pulido, Isabel de Sousa, Kamal Sikka, Takashi Hisada
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2f06610f02de551c38cd6ad101c6551
https://doi.org/10.1109/ectc51906.2022.00105
https://doi.org/10.1109/ectc51906.2022.00105
Autor:
Chinami Marushima, Toyohiro Aoki, Koki Nakamura, Risa Miyazawa, Akihiro Horibe, Isabel de Sousa, Kamal Sikka, Takashi Hisada
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1fdd11e759e97dc5403aef037e0a182
https://doi.org/10.1109/ectc51906.2022.00098
https://doi.org/10.1109/ectc51906.2022.00098
Autor:
Akihiro Horibe, Chinami Marushima, Takahito Watanabe, Aakrati Jain, Eric Turcotte, Isabel de Sousa, Kamal Sikka, Takashi Hisada
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db2bb83c846d82133898af9364b3af01
https://doi.org/10.1109/ectc51906.2022.00106
https://doi.org/10.1109/ectc51906.2022.00106
Publikováno v:
International Symposium on Microelectronics. 2020:000119-000124
Injection Molded Solder (IMS) process has been developed as one of the advanced micro-bumps forming techniques. This paper presents a novel IMS process utilizing a double-layer resist patterning with expanded opening for the reduction of required inj
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64380103cde1b164395f617fb11749b3
https://doi.org/10.4071/2380-4505-2020.1.000119
https://doi.org/10.4071/2380-4505-2020.1.000119
Autor:
Kamal Sikka, Isabel De Sousa, Aakrati Jain, Chinami Marushima, Toyohiro Aoki, Sayuri Kohara, Hiroyuki Mori, Takashi Hisada
Publikováno v:
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f9b64129e127f94f5fc9aa70d5c41ae
https://doi.org/10.1109/edtm53872.2022.9798272
https://doi.org/10.1109/edtm53872.2022.9798272
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Capillary Underfill (CUF) process has been widely used in flip-chip packaging since it offers significant improvement of the solder joint reliability. This study focuses on the underfill flow behavior of a multi-chip module with a cavity in the lamin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e35d59b12bbb8d1fe87b137735a52c1d
https://doi.org/10.1109/ectc32696.2021.00172
https://doi.org/10.1109/ectc32696.2021.00172
Autor:
Sayuri Kohara, Ryota Yamaguchi, Kuniaki Sueoka, Takashi Hisada, Nobuhiro Sekine, Kenichi Yatsugi, Toyohiro Aoki, Chinami Marushima
Publikováno v:
2021 International Conference on Electronics Packaging (ICEP).
We have developed a plating-free bumping technology by using Cu nanopaste and Injection Molded Solder (IMS) method. In this bumping process, Cu pillars are formed by filling Cu nanopaste into photoresist openings and sintering. IMS method is then app
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ebc76b088c4ce8433dc9d7b573a6c39
https://doi.org/10.23919/icep51988.2021.9451976
https://doi.org/10.23919/icep51988.2021.9451976
Autor:
Sayuri Kohara, Chinami Marushima, Kenichi Yatsugi, Makoto Yada, Eiji Nakamura, Toyohiro Aoki, Nobuhiro Sekine, Kuniaki Sueoka, Takashi Hisada, Ryota Yamaguchi
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
We have newly developed a plating-free bumping process by Cu nanopaste with injection molded solder (IMS) technology. In the new process, Cu pillars are fabricated by filling photoresist openings with Cu nanopaste followed by pressure-free Cu sinteri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ef66ab1caa2f6f31b1675cbe169165f
https://doi.org/10.1109/ectc32862.2020.00122
https://doi.org/10.1109/ectc32862.2020.00122