Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Chin-Tang Hsieh"'
Autor:
Chin-Tang Hsieh, 謝慶堂
96
III Abstract There has been an extensive research and development effort devoted in Field Emission Display. They are considered to be important cold cathode materials; for instance, the metal, nonmetal and metal-silicide are important refract
III Abstract There has been an extensive research and development effort devoted in Field Emission Display. They are considered to be important cold cathode materials; for instance, the metal, nonmetal and metal-silicide are important refract
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/86867006463994890629
Publikováno v:
Journal of Business Administration (1025-9627); Jun2020, Vol. 45 Issue 2, p75-100, 26p
Autor:
Chin Tang Hsieh, Jyh Ming Ting
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 25:1552-1556
We report the fabrication and characterization of tungsten films obtained using a thermal evaporation method. Single phase α-tungsten films were obtained at higher substrate temperatures (520–680°C) than the single phase β-tungsten films (180–
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::714e850d945b3b8d7654b206b8af37f5
https://doi.org/10.1116/1.2790913
https://doi.org/10.1116/1.2790913
Publikováno v:
Journal of Accounting, Finance & Management Strategy; Dec2019, Vol. 14 Issue 2, p153-172, 20p
Publikováno v:
Commerce & Management Quarterly; Dec2019, Vol. 20 Issue 4, p403-436, 34p
Autor:
Chin Tang Hsieh, Jyh-Ming Ting
Publikováno v:
Chemical Physics Letters. 413:84-87
A thermal evaporation method was used for the deposition of tungsten films. The tungsten source was resistively heated to a temperature between 1810 and 2010 °C for the deposition. The resulting BCC α-tungsten film exhibits a rod-like structure and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a60401b31dbda4554a6c0ab833715b0
https://doi.org/10.1016/j.cplett.2005.07.050
https://doi.org/10.1016/j.cplett.2005.07.050
Autor:
Chin-Tang Hsieh, Hsu You-Ming, Fei-Jain Wu, Chih-Ming Kuo, Shih-Chieh Chang, Chih-Hsien Ni, Hui-Yu Huang, Lung-Hua Ho, Chia-Jung Tu, Chuan-Yu Wu, Kung-An Lin
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Fine pitch vertical interconnect has been extensively studied to meet the demand of next generation 3D packaging requirements. Copper pillar bump has received much of attentions as the choice for connecting chips due to its fine pitch and favorable r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::faa43bb4b8e30d680c2dd4e9bc00fb99
https://doi.org/10.1109/ectc.2013.6575842
https://doi.org/10.1109/ectc.2013.6575842
Publikováno v:
BIBE
A low power, portable, and easily implemented Holter recorder is necessary for patients or researchers of electrocardiogram (ECG). Such a Holter recorder with off-the-shelf components is realized with mixed signal processor (MSP) in this paper. To de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4762da9068e89e81fdb39c40dfae332
https://doi.org/10.1109/bibe.2005.2
https://doi.org/10.1109/bibe.2005.2
Publikováno v:
Fifth IEEE Symposium on Bioinformatics & Bioengineering (BIBE'05); 2005, p316-319, 4p