Zobrazeno 1 - 10
of 41
pro vyhledávání: '"Chin-Chung Wei"'
Autor:
Chin-Chung Wei, 魏金泉
97
ISO 9000 Quality management systems have been applied profoundly because of the rationality with easy to use system. European clients strongly require ISO9000 recognition, and highly promote this quality management system globally. ISO9000 ha
ISO 9000 Quality management systems have been applied profoundly because of the rationality with easy to use system. European clients strongly require ISO9000 recognition, and highly promote this quality management system globally. ISO9000 ha
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/67790689521199107807
Autor:
Chin-chung Wei, 魏清忠
95
At present, chemical mechanical polishing (CMP) is the most effective technology to achieve global planarization in semiconductor manufacturing processes. In recent years, the feature size of the IC processes is down to the nanometer range. B
At present, chemical mechanical polishing (CMP) is the most effective technology to achieve global planarization in semiconductor manufacturing processes. In recent years, the feature size of the IC processes is down to the nanometer range. B
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/09326768543061965596
Autor:
Chin-Chung Wei, 魏進忠
91
The purpose of this study is to create an effective method to study kinematics and tribological behavior of a ball screw operating under different operating conditions. The analysis is able to realize how the ball screw parameters including c
The purpose of this study is to create an effective method to study kinematics and tribological behavior of a ball screw operating under different operating conditions. The analysis is able to realize how the ball screw parameters including c
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/75788709062950660313
Autor:
Chin-Chung Wei, 魏志忠
90
A Case Study on Business Merge and Acquisition Student:Chin-Chung Wei Advisor:Bing-Jyun Wang Abstract In 2001, Taiwanese semiconductor industry environment is turbulent. Five related companies, UMC、USC、USI、UICC、UTEK, were merged i
A Case Study on Business Merge and Acquisition Student:Chin-Chung Wei Advisor:Bing-Jyun Wang Abstract In 2001, Taiwanese semiconductor industry environment is turbulent. Five related companies, UMC、USC、USI、UICC、UTEK, were merged i
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/00762430867944679367
Autor:
I Chuan Lu, Chin Chung Wei
Publikováno v:
Key Engineering Materials. 823:145-150
In the manufacturing process of steel pipes, bending or torsion deformation is most usual happened by the variation of temperature, external extension or compression, inner residual stress. The straighten quality is thus out of standard. Tilt roller
Autor:
Yih Chyun Hwang, He Qing He, Jen Fin Lin, Yueh Lin Chiu, Jeng Haur Horng, Chin Chung Wei, Chang Fu Han
Publikováno v:
Measurement. 126:274-288
This study focuses on the acquisitions of vibration and torque signals of a ball screw drive system in upward-downward reciprocating motion and data processing techniques in order to identify the longest running distance under normal operation withou
Autor:
Yih Chyun Hwang, Jen Fin Lin, Chin Chung Wei, Chang Fu Han, Yueh Lin Chiu, Neng Tung Liao, Ping Hsueh Tsai, Ruei Yang Luo, Guan Lin Chen, Hsiao Yeh Chu
Publikováno v:
Wear. :126-139
Ball-bearing-like specimens are prepared with three groove factors (GF ≡ r/D; r: radius of groove; D: diameter of ball). Analyses of operating conditions are conducted for the thrust loads applied to the dry-contact specimens running with the maxim
Publikováno v:
Applied Mechanics and Materials. 883:22-29
High speed transmission table is wildly used in industry and the demand is increased recently. High speed ball-screw device is a major component in the system. High speed transmission brings high friction and causes serious thermal displacement, espe
Publikováno v:
Key Engineering Materials. 739:187-192
In this study, test specimens of nanocomposites were produced through Vacuum Assisted Resin Transfer Molding process, VARTM. By using Epoxy as substrate, test specimens of Nanocomposites were prepared as multiple layers of carbon fibers, clay and car
Autor:
Chin-Chung Wei, Chun-An Cheng
Publikováno v:
Lecture Notes in Mechanical Engineering ISBN: 9789811395383
This article investigate the influence of different sawing angle and different band saw cutting speed by measuring the sawing vibration, motor current and shear stress caused by sawing. The band saw carrier stand are the closest fixing parts of the s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80c11e57a579e84dec47d23815c45815
https://doi.org/10.1007/978-981-13-9539-0_31
https://doi.org/10.1007/978-981-13-9539-0_31