Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Chin Lap Sin"'
Publikováno v:
2007 International Conference on Electronic Materials and Packaging.
In the competition of market share of quad flat no-lead (QFN) package, there were several improvement methods being utilized, such as leadframe design for higher density, cheaper tape, and more functionalities per chip (with smaller package size, lar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f121eee309d297912e1ac3ce7d5695a0
https://doi.org/10.1109/emap.2007.4510275
https://doi.org/10.1109/emap.2007.4510275
Publikováno v:
2008 10th Electronics Packaging Technology Conference; 2008, p475-480, 6p
Publikováno v:
2007 International Conference on Electronic Materials & Packaging; 2007, p1-5, 5p