Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Chin Hao Tsai"'
Publikováno v:
Journal of Materials Research and Technology, Vol 19, Iss , Pp 3828-3841 (2022)
Silver (Ag) sintering is widely adopted as a die attach method for power electronics packaging. However, oxidation, massive grain growth, and increasing porous structure occur in sintered Ag joints at high temperatures, resulting in decreasing mechan
Externí odkaz:
https://doaj.org/article/271ba08dba8d40179d1620b1bd9d3451
Publikováno v:
Materials, Vol 16, Iss 18, p 6263 (2023)
Indium is considered a candidate low-temperature solder because of its low melting temperature and excellent mechanical properties. However, the solid-state microstructure evolution of In with different substrates has rarely been studied due to the s
Externí odkaz:
https://doaj.org/article/ad8eeb9576934420b47d9535e8ba2f87
Autor:
Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, Jiahui Li, Hiroshi Nishikawa, C.R. Kao
Publikováno v:
Journal of Materials Research and Technology, Vol 15, Iss , Pp 4541-4553 (2021)
Sintered silver paste is a popular material for die attachment technology in power electronics. However, using traditional nano-silver paste when fabricating sintered joints has intrinsic material problems that cannot be overcome, such as the high co
Externí odkaz:
https://doaj.org/article/50ec2105ac7343609efeb9b1e75ff6d0
Publikováno v:
Materials, Vol 15, Iss 4, p 1397 (2022)
Sintered silver paste is widely used as the die-attachment material for power semiconductors. However, sintered silver joints encounter problems, such as severe coarsening of sintered pores and oxidation issues, in harsh high-temperature environments
Externí odkaz:
https://doaj.org/article/af5de91d5e304c67a0985f3880909299
Autor:
Chin-Hao Tsai, Han-Tang Hung, Fu-Ling Chang, Steffen Bickel, Maik Müller, Iuliana Panchenko, Karlheinz Bock, C.R. Kao
Publikováno v:
Journal of Materials Research and Technology. 19:2510-2515
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Autor:
Hiroshi Nishikawa, Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, C. R. Kao, Jiahui Li
Publikováno v:
Journal of Materials Research and Technology, Vol 15, Iss, Pp 4541-4553 (2021)
Sintered silver paste is a popular material for die attachment technology in power electronics. However, using traditional nano-silver paste when fabricating sintered joints has intrinsic material problems that cannot be overcome, such as the high co
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Publikováno v:
Materials; Volume 15; Issue 4; Pages: 1397
Sintered silver paste is widely used as the die-attachment material for power semiconductors. However, sintered silver joints encounter problems, such as severe coarsening of sintered pores and oxidation issues, in harsh high-temperature environments
Autor:
Hiroshi Nishikawa, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, Chin-Hao Tsai, C. Robert Kao
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Over the past decades, the demands for high temperature power electronics for automotive applications increased continuously. Inverters and converters in power integrated circuit modules dominate both energy conversion efficiency and performance in e