Zobrazeno 1 - 10
of 50
pro vyhledávání: '"Chilgee Lee"'
Publikováno v:
Science of Advanced Materials. 10:293-296
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b1af336e4344349dd11125b797dfac1
https://doi.org/10.1166/sam.2018.2973
https://doi.org/10.1166/sam.2018.2973
Publikováno v:
Wireless Personal Communications. 88:319-336
The increased use of smart devices has led to rapid growth in the application (app) market. Many apps have taken advantage of push service to provide real-time notifications to smart device users. In this paper, it is described the operation mechanis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98905143a3316539a015810dacc755ea
https://doi.org/10.1007/s11277-015-3122-7
https://doi.org/10.1007/s11277-015-3122-7
Publikováno v:
ETRI Journal.
System-on-Chip (SoC) designs have a number of flipflops and it requires a long scan test application time. Scan shift operation takes a significant portion of scan test application time. This paper presents physical aware approaches for speeding up a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7b8bfb67107f1b2503a00c5cf1c9ce4
https://doi.org/10.4218/etrij.16.0115.0779
https://doi.org/10.4218/etrij.16.0115.0779
Publikováno v:
Journal of Electronic Materials. 42:97-102
Polishing debris generated by pad surface conditioning has been suspected as a major source of microscratches in the chemical–mechanical planarization (CMP) process. In this study, we investigated the pad debris generated by an in situ conditioning
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5af387af46df4202375d25248967fd8e
https://doi.org/10.1007/s11664-012-2334-9
https://doi.org/10.1007/s11664-012-2334-9
Publikováno v:
Microelectronic Engineering. 88:2604-2607
The fabrication process of semiconductor is more and more difficult as scaling down. Especially, the via profile formation is one of the main challenges which is suffering from making stable device process because ArF photo resist (PR) itself can not
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a69514ac3ac57240524f05536e1448ba
https://doi.org/10.1016/j.mee.2011.02.057
https://doi.org/10.1016/j.mee.2011.02.057
Autor:
Junsin Yi, Jinho Joo, Won Nam Kang, Seung Muk Lee, B.-H. Jun, Jun Hyung Lim, Chilgee Lee, Geun Chul Park, C.-J. Kim
Publikováno v:
Physica C: Superconductivity and its Applications. 470:1438-1441
We fabricated lauric acid (LA) doped MgB 2 wires and investigated the effects of the LA doping. For the fabrication of the LA-doped MgB 2 wires, B powder was mixed with LA at 0–5 wt.% of the total amount of MgB 2 using an organic solvent, dried, an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8b1118b1158049f5a371bb3d4ba643d
https://doi.org/10.1016/j.physc.2010.05.132
https://doi.org/10.1016/j.physc.2010.05.132
Publikováno v:
International Journal of Machine Tools and Manufacture. 50:860-868
Wafer removal rates and defects were investigated for 200 mm tetraethyl orthosilicate (TEOS) oxide chemical mechanical planarization (CMP) processes using two types of CMP pads: a porous pad and a solid pad with micro-holes. An initial CMP test condu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b28ec706691c52194ae225d1dfc6f12
https://doi.org/10.1016/j.ijmachtools.2010.06.007
https://doi.org/10.1016/j.ijmachtools.2010.06.007
Publikováno v:
Physica C: Superconductivity. 469:1527-1530
We fabricated ex situ MgB 2 wires using C-doped MgB 2 powder as a precursor in order to improve the core density of the wires and their C doping content. The C-doped powder was prepared with Mg, B, and nano carbon (NC) powders by the in situ techniqu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d63836c05490dfed47bb9ffa89ab140
https://doi.org/10.1016/j.physc.2009.05.228
https://doi.org/10.1016/j.physc.2009.05.228
Autor:
Young-Hyun Jun, Tae Hee Han, Joung-yeal Kim, Chilgee Lee, Su-Jin Park, Yong-Gu Kang, Bai-Sun Kong
Publikováno v:
IEICE Electronics Express. 6:736-742
In this paper, a novel CMOS charge pump with substantially improved immunity to latch-up is presented. By utilizing a dedicated bulk pumping and blocking (DBPB) technique, the proposed charge pump achieves greatly reduced forward voltage of source/dr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::95ef8787b4022bfe667444a15cf313c0
https://doi.org/10.1587/elex.6.736
https://doi.org/10.1587/elex.6.736
Publikováno v:
Microelectronics Journal. 38:1042-1049
This paper presents novel low-cost CMOS temperature sensor for controlling the self-refresh period of a mobile DRAM. In the proposed temperature sensor, the temperature dependency of poly resistance is used to generate a temperature-dependent bias cu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9766710ffaefe969f1154478c9ad5c1
https://doi.org/10.1016/j.mejo.2007.08.003
https://doi.org/10.1016/j.mejo.2007.08.003