Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Chikako Takato"'
Publikováno v:
Solid State Phenomena. 255:201-206
We quantitatively evaluate the wet cleaning performance of particle cotamination. We made particle sample which endure the wet cleaning and measured particle adhesion force by self-sensitive cantilever. The advantage of this method is that performed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::29d088a066481b150743e4e08dcfdf9f
https://doi.org/10.4028/www.scientific.net/ssp.255.201
https://doi.org/10.4028/www.scientific.net/ssp.255.201
Publikováno v:
The Proceedings of Conference of Kanto Branch. :18A07
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3de0e32236cbda10ee34e7793af9d0fe
https://doi.org/10.1299/jsmekanto.2019.25.18a07
https://doi.org/10.1299/jsmekanto.2019.25.18a07
Publikováno v:
The Proceedings of Conference of Kanto Branch. :OS0108
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af464e354d428936617a0b07b4f57333
https://doi.org/10.1299/jsmekanto.2018.24.os0108
https://doi.org/10.1299/jsmekanto.2018.24.os0108
Autor:
Yutaka Wada, Chikako Takato, Syuhei Kurokawa, Masashi Kitamura, Terutake Hayashi, Hirokuni Hiyama, Yuta Tokumoto
Publikováno v:
The Proceedings of Conference of Kyushu Branch. :9-10
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f43af3b93fcf7d658e99774ee19d1ca9
https://doi.org/10.1299/jsmekyushu.2016.69.9
https://doi.org/10.1299/jsmekyushu.2016.69.9
Autor:
Masashi Kitamura, Terutake Hayashi, Hirokuni Hiyama, Chikako Takato, Yuta Tokumoto, Yutaka Wada, Syuhei Kurokawa
Publikováno v:
The Proceedings of Conference of Kyushu Branch. :7-8
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67430d30c6793a4e289c86ed2dba512b
https://doi.org/10.1299/jsmekyushu.2016.69.7
https://doi.org/10.1299/jsmekyushu.2016.69.7
Publikováno v:
Proceedings of International Conference on Planarization/CMP Technology 2014.
Increases in the sizes of silicon wafers and the degree of circuit integration has led to a requirement for a reduction in the size and number of defects, including defects caused by corrosion during the Cu-chemical mechanical polishing (CMP) or clea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59afa188b5f67a2a8a09d1a8fc21d71f
https://doi.org/10.1109/icpt.2014.7017295
https://doi.org/10.1109/icpt.2014.7017295
Autor:
Masashi Kitamura, Chikako Takato, Syuhei Kurokawa, Terutake Hayashi, Hirokuni Hiyama, Yuta Tokumoto, Yutaka Wada
Publikováno v:
The Proceedings of Conference of Kyushu Branch. :329-330
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::640b92d96145a0897aaf98a3b1fb29d9
https://doi.org/10.1299/jsmekyushu.2015.68.329
https://doi.org/10.1299/jsmekyushu.2015.68.329
Publikováno v:
The Proceedings of the Fluids engineering conference. 2016:0506
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f5e083946a674fcc9f940123efba0d1
https://doi.org/10.1299/jsmefed.2016.0506
https://doi.org/10.1299/jsmefed.2016.0506
Publikováno v:
The Proceedings of Conference of Kanto Branch. :OS0106-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ebee5738470d0b4775508121b8eb7512
https://doi.org/10.1299/jsmekanto.2016.22._os0106-1_
https://doi.org/10.1299/jsmekanto.2016.22._os0106-1_
Publikováno v:
The Proceedings of Conference of Kanto Branch. :573-574
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a1a4118e1744d43cdfe1055d29347b17
https://doi.org/10.1299/jsmekanto.2011.17.573
https://doi.org/10.1299/jsmekanto.2011.17.573