Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Chih-Lun Wang"'
Autor:
Chih-Lun Wang, 王志倫
101
Benign prostatic hyperplasia (BPH) is caused by the augmented levels of androgen dihydrotestosterone (DHT) that is involved in the growth of prostate in human. 5a-Reductase type II (5aR2) is an intracellular enzyme that catalyzes the formati
Benign prostatic hyperplasia (BPH) is caused by the augmented levels of androgen dihydrotestosterone (DHT) that is involved in the growth of prostate in human. 5a-Reductase type II (5aR2) is an intracellular enzyme that catalyzes the formati
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/42hwgv
Autor:
Chih-Lun Wang, 王志倫
97
This study uses simulation to analyze bidding strategies and the gaming situation for two OEM manufacturers and one brand enterprise. Each manufacturer evaluates and submits its bid based on order information, current workload, and previous b
This study uses simulation to analyze bidding strategies and the gaming situation for two OEM manufacturers and one brand enterprise. Each manufacturer evaluates and submits its bid based on order information, current workload, and previous b
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/61452909297717996042
Autor:
Chih-Lun Wang, 王志倫
95
In this study, we grow four InGaN/GaN multiple quantum well (MQW) LED structures by MOVPE on c-plane sapphire substrates. For investigating the coupled structure influence, we insert a short InxGa1-xN barrier in the center of the quantum well
In this study, we grow four InGaN/GaN multiple quantum well (MQW) LED structures by MOVPE on c-plane sapphire substrates. For investigating the coupled structure influence, we insert a short InxGa1-xN barrier in the center of the quantum well
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/00039714675870020485
Publikováno v:
2022 IEEE Energy Conversion Congress and Exposition (ECCE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::33ca0a252ed25d5688062ebdfeae8e08
https://doi.org/10.1109/ecce50734.2022.9948049
https://doi.org/10.1109/ecce50734.2022.9948049
Autor:
Ting-Yang Yu, Chih-Lun Wang, Yu-Hua Chen, Tzu-Chieh Chou, Cheng-Ta Ko, Kai-Ming Yang, Kuan-Neng Chen, Yu-Tao Yang, Jim-Wein Lin, Tzyy-Jang Tseng
Publikováno v:
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
In this study, Cu-Cu bonding with pillar-concave structure on a polymer layer was investigated to realize better bonding quality at lower temperature, while a low-stress release layer for temporary bond and de-bond by laser ablation was demonstrated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f20d25ef2a75b8add125652da1b5667
https://doi.org/10.23919/ltb-3d.2017.7947414
https://doi.org/10.23919/ltb-3d.2017.7947414
Autor:
Ernesto Inoa, Luis Herrera, Feng Guo, Robert Murawski, Chih-Lun Wang, P. Beauchamp, Jin Wang, Eylem Ekici
Publikováno v:
IEEE Transactions on Industry Applications. 49:899-908
This paper presents a real-time simulation platform for smart grid applications. The developed platform is capable of simulating complex smart grid models with large numbers of high-speed switching devices at real time. Furthermore, an integrated app
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4092f7fd060c37163b51217c20159a19
https://doi.org/10.1109/tia.2013.2240642
https://doi.org/10.1109/tia.2013.2240642
Autor:
Chih-Lun Wang, Ra-Min Tain, Zih-Yu Ciou, Yan-bin Chang, Meng-Fan Chang, Cheng-Hsiung Wang, Kai-Ming Yang, Dyi-Chung Hu, Yu-Hua Chen, Han-Wen Hu, Ching Chang
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
This paper is to present an assembly structure of system-in-package (SiP) module using the glass substrate with through-glass via (TGV) where the diameter of TGV is 100μm and the glass substrate is 200μm thick. The glass-substrate is first laminate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::330176a059900aa65f5418a94a10ce64
https://doi.org/10.1109/impact.2016.7800004
https://doi.org/10.1109/impact.2016.7800004
Autor:
Chingchi Chen, Chih-Lun Wang
Publikováno v:
2015 IEEE Applied Power Electronics Conference and Exposition (APEC).
In this paper, the radiated immunity problem of the Electronic Control Modules (ECUs) on a vehicle is investigated using the transfer function method, which characterizes the system frequency response by measuring the attenuation of the signal throug
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68c26949695c93336d437c0eb0858f08
https://doi.org/10.1109/apec.2015.7104709
https://doi.org/10.1109/apec.2015.7104709
Autor:
Luis Herrera, Jin Wang, Chih-Lun Wang, Yi Huang, Philippe Beauchamp, Ernesto Inoa, Robert Murawski, Feng Guo, Eylem Ekici
Publikováno v:
2011 IEEE Energy Conversion Congress and Exposition.
This paper introduces the latest real time simulation technologies and their applications to the smart grid related studies. A real time simulation platform now built at the Ohio State University is described in detail. With the help of this platform
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3655783fba59a9201e431d23e1552b3
https://doi.org/10.1109/ecce.2011.6063883
https://doi.org/10.1109/ecce.2011.6063883
Autor:
Feng Guo, Herrera, L., Murawski, R., Inoa, E., Chih-Lun Wang, Yi Huang, Ekici, E., Jin Wang, Beauchamp, P.
Publikováno v:
2011 IEEE Energy Conversion Congress & Exposition (ECCE); 2011, p1013-1018, 6p