Zobrazeno 1 - 10
of 62
pro vyhledávání: '"Chih-Hung Jen"'
Autor:
Vasileios L. Zogopoulos, Georgia Saxami, Apostolos Malatras, Antonia Angelopoulou, Chih-Hung Jen, William J. Duddy, Gerasimos Daras, Polydefkis Hatzopoulos, David R. Westhead, Ioannis Michalopoulos
Publikováno v:
iScience, Vol 24, Iss 8, Pp 102848- (2021)
Summary: Gene coexpression analysis refers to the discovery of sets of genes which exhibit similar expression patterns across multiple transcriptomic data sets, such as microarray experiment data of public repositories. Arabidopsis Coexpression Tool
Externí odkaz:
https://doaj.org/article/91928281b65f438d9705d5ef422a8fa2
Autor:
Shu-Kai S. Fan, Chih-Hung Jen
Publikováno v:
Mathematics, Vol 7, Iss 4, p 357 (2019)
Particle swarm optimization (PSO) is a population-based optimization technique that has been applied extensively to a wide range of engineering problems. This paper proposes a variation of the original PSO algorithm for unconstrained optimization, du
Externí odkaz:
https://doaj.org/article/25deafb48bc64ddd9137008b03b4fb35
Autor:
Chih-Yung Yang, Ruey-Hwa Lu, Chien-Hsing Lin, Chih-Hung Jen, Chien-Yi Tung, Shung-Haur Yang, Jen-Kou Lin, Jeng-Kai Jiang, Chi-Hung Lin
Publikováno v:
PLoS ONE, Vol 9, Iss 6, p e100060 (2014)
Given the significant racial and ethnic diversity in genetic variation, we are intrigued to find out whether the single nucleotide polymorphisms (SNPs) identified in genome-wide association studies of colorectal cancer (CRC) susceptibility in East As
Externí odkaz:
https://doaj.org/article/cd8edb6572f449a1b6b446ca77757905
Autor:
Chen-Yi Wang, Chia-Yin Hua, Hsiang-En Hsu, Chia-Ling Hsu, Hsin-Yi Tseng, Duncan E Wright, Pang-Hung Hsu, Chih-Hung Jen, Chia-Yeh Lin, Meng-Ying Wu, Min-Daw Tsai, Cheng-Fu Kao
Publikováno v:
PLoS ONE, Vol 6, Iss 7, p e22209 (2011)
Telomeric heterochromatin assembly in budding yeast propagates through the association of Silent Information Regulator (SIR) proteins with nucleosomes, and the nucleosome array has been assumed to fold into a compacted structure. It is believed that
Externí odkaz:
https://doaj.org/article/42e2b95715a4474c90ac2132713d224b
Autor:
Chih-Hung Jen, 任志宏
95
During the past decade, a variety of ‘run-to-run’ (R2R) control schemes have been proposed and investigated extensively under various semiconductor manufacturing methods. However, such control has a problem when it is suddenly faced with
During the past decade, a variety of ‘run-to-run’ (R2R) control schemes have been proposed and investigated extensively under various semiconductor manufacturing methods. However, such control has a problem when it is suddenly faced with
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/13607172864224565766
Publikováno v:
Journal of Manufacturing Science & Engineering; Jul2024, Vol. 146 Issue 7, p1-11, 11p
Autor:
Chih-Hung Jen, 任志宏
93
Controlled Low Strength Materials (CLSM) is a self-compacted, cementitious material, and the primary application is as structural fill or backfill in place of compacted soil. However, there was no efficient way to check the setting time and t
Controlled Low Strength Materials (CLSM) is a self-compacted, cementitious material, and the primary application is as structural fill or backfill in place of compacted soil. However, there was no efficient way to check the setting time and t
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/28211397769190350604
Autor:
Chih-Hung Jen, 任志宏
89
During recent years, “Run-to-Run” (R2R) control techniques have been developed and used to control various semiconductor manufacturing processes. The R2R control methodology combines response surface modeling, engineering process control
During recent years, “Run-to-Run” (R2R) control techniques have been developed and used to control various semiconductor manufacturing processes. The R2R control methodology combines response surface modeling, engineering process control
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/51333922255782880902
Publikováno v:
IEEE Transactions on Automation Science and Engineering. 19:1530-1541
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3c5c15787b87a3f7916def28757f111b
https://doi.org/10.1109/tase.2022.3141426
https://doi.org/10.1109/tase.2022.3141426
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 35:186-197
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d74c94a0204dc3864735a56d35b5a292
https://doi.org/10.1109/tsm.2021.3137982
https://doi.org/10.1109/tsm.2021.3137982