Zobrazeno 1 - 10
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pro vyhledávání: '"Chih-Horng Chang"'
Autor:
Chih-Horng Chang, 張志鴻
93
A201 aluminum alloy (Al-4.6Cu-0.3Mg-0.6Ag) has been widely applied in the aviation and military industries due to its very high mechanical strength and thermal stability. The silver containing, between 0.4 to 1 wt.%, is unequal characteristic
A201 aluminum alloy (Al-4.6Cu-0.3Mg-0.6Ag) has been widely applied in the aviation and military industries due to its very high mechanical strength and thermal stability. The silver containing, between 0.4 to 1 wt.%, is unequal characteristic
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/29964432183414091093
Autor:
Chih-Horng Chang, 張志鴻
82
CMAC類神經網路是一種可以有效的改善非線性控制系統的工具。由我們的 模擬和實驗的結果顯示，它的確可以有效的降低追蹤控制的誤差，但是它 也會造成系統的不穩定。在本論文中
CMAC類神經網路是一種可以有效的改善非線性控制系統的工具。由我們的 模擬和實驗的結果顯示，它的確可以有效的降低追蹤控制的誤差，但是它 也會造成系統的不穩定。在本論文中
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/68586319225786404905
Publikováno v:
Journal of Applied Physics; Mar2008, Vol. 103 Issue 6, p063518, 4p, 1 Color Photograph, 1 Diagram, 1 Graph
Publikováno v:
Journal of Materials Research. 24:2628-2637
Ternary Sn-In-Cu alloys are prepared and equilibrated at 250 °C for 2 to 20 weeks. The phases formed in these alloys are experimentally determined. The 250 °C Sn-In-Cu isothermal section is established according to the phase equilibrium information
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eac964ff4425b495c48d8b48a8dd2117
https://doi.org/10.1557/jmr.2009.0317
https://doi.org/10.1557/jmr.2009.0317
Publikováno v:
Journal of Materials Research. 23:2743-2748
Ni–7 wt% V diffusion barrier is commonly used in flip chip technology, and Sn is the primary element of all commercial electronic solders. Different from the interfacial reactions in the Sn/Ni couples, a ternary T phase is formed in the Sn/Ni–7 w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3015a1e2250186306aa86e02f762899
https://doi.org/10.1557/jmr.2008.0338
https://doi.org/10.1557/jmr.2008.0338
Publikováno v:
Journal of Materials Research. 23:1895-1901
Sn–0.7 wt% Cu alloy is an important Pb-free solder, and Ni–7 wt% V is the major diffusion barrier layer material of flip chip technology. Reactions at the Sn–0.7 wt% Cu/Ni–7 wt% V interface are examined at 160, 180, and 210 °C. Only the Cu6S
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::779a47eb11106ffc1d7c3b7061afa072
https://doi.org/10.1557/jmr.2008.0235
https://doi.org/10.1557/jmr.2008.0235
Publikováno v:
Metallurgical and Materials Transactions A. 38:2832-2842
This work explores how the Cu/Mg ratio affects the thermal stability of the extrusion of Al-4.6 pct Cu-Mg-Ag alloys at aerodynamic heating temperatures of up to 155 °C for 1000 hours. The Cu/Mg ratio was modified by adding various amounts of element
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d33f109b04f40da9dc13432b6c88e277
https://doi.org/10.1007/s11661-007-9332-1
https://doi.org/10.1007/s11661-007-9332-1
Publikováno v:
Scripta Materialia. 56:453-456
In the early stage of the Sn/Ni–7 wt.%V reaction at 200 °C, solid state amorphization reaction occurs and an amorphous T phase layer is formed. After 48 h of reaction, a Ni3Sn4 phase layer is formed between Sn and the T phase, and the reaction pat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4988b2765043428bc90cb165d3d3967
https://doi.org/10.1016/j.scriptamat.2006.12.002
https://doi.org/10.1016/j.scriptamat.2006.12.002
Publikováno v:
Corrosion Science. 48:3139-3156
Effect of heat treatments (namely T6, T73, RRA, OP1 and OP2) on the tensile strength (TS) and stress corrosion cracking (SCC) resistance of aluminum alloy 7050 in 3.5% NaCl solution at pH 12 has been investigated using constant extension rate tester
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f231f8ad3edb79d3fd6e9b6107b91159
https://doi.org/10.1016/j.corsci.2005.11.009
https://doi.org/10.1016/j.corsci.2005.11.009