Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Chih-Heng Chao"'
Autor:
Su-Mei Chen, Yu-Min Lin, Cheng-Ta Ko, Yu-Wei Huang, Yoshikazu Suzuki, Ren-Shin Cheng, Chang-Chun Lee, Chau-Jie Zhan, Yoshihiro Tsutsumi, Huan-Chun Fu, Chun-Hsien Chien, Yu-Huan Guo, Zhi-Cheng Hsiao, Chia-Wen Fan, Yusuke Sato, Shin-Yi Huang, Junsoo Woo, Chih-Heng Chao, Chien-Ting Liu
Publikováno v:
2014 International Conference on Electronics Packaging (ICEP).
A novel assembly process was developed for ultra-thin chip stacking technology where wafer-level-packaging (WLP) was adopted and combined with chip-on-wafer (CoW) technology. By such assembly process, thin chip handling would be unnecessary in this p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b30b42f30c50bd43cc485023e41f676
https://doi.org/10.1109/icep.2014.6826723
https://doi.org/10.1109/icep.2014.6826723
Autor:
Yu-Min Lin, Chau-Jie Zhan, Zhi-Cheng Hsiao, Huan-Chun Fu, Ren-Shin Cheng, Yu-Wei Huang, Shin-Yi Huang, Su-Mei Chen, Chia-Wen Fan, Chun-Hsien Chien, Cheng-Ta Ko, Yu-Huan Guo, Chang-Chun Lee, Tsutsumi, Yoshihiro, Junsoo Woo, Suzuki, Yoshikazu, Sato, Yusuke, Chien-Ting Liu, Chih-Heng Chao
Publikováno v:
2014 International Conference on Electronics Packaging (ICEP); 2014, p470-474, 5p