Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Chih han Yang"'
Publikováno v:
Journal of Materials Research and Technology, Vol 30, Iss , Pp 16-24 (2024)
The rhombohedral structure is with anisotropic properties, leading to brittle mechanical properties. However, it is one of the major constituent phases, the (Bi) phase, in the Sn–Bi-based low-temperature solders, which is demanding in the electroni
Externí odkaz:
https://doaj.org/article/8548a24eddc94925b605cc1664cfaad6
Autor:
Yu-An Shen, Shiqi Zhou, Jiahui Li, Chih-han Yang, Sijie Huang, Shih-kang Lin, Hiroshi Nishikawa
Publikováno v:
Materials & Design, Vol 183, Iss , Pp - (2019)
Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow proces
Externí odkaz:
https://doaj.org/article/bfb21d587dee4de28b9b2f48cdddf76e
Publikováno v:
Science and Technology of Welding and Joining. 27:572-578
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Publikováno v:
JOM. 74:1751-1759
Sn-58Bi, an eutectic alloy, has been explored for use as a low-temperature lead-free solder alloy. However, the properties of Sn-Bi alloys as well as those of their joints need to be improved significantly so that these alloys can be applicable for p
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Autor:
Tzu-Hsuan Huang, Yu-Chen Liu, Cheng-En Cheng, Chien-Wei Huang, Chih-Han Yang, Chih-Feng Lin, Cheng-Chi Wang, Shih-Kang Lin
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Publikováno v:
Materials, Vol 12, Iss 4, p 631 (2019)
Low-temperature lead (Pb)-free solders are demanding in the electronic packaging industry, because it would open the door for various economic choices of polymeric materials as substrates and also revives the lower cost processes. Here, we proposed a
Externí odkaz:
https://doaj.org/article/dfe870c461c64795a07f47f0c0a0797b