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of 32
pro vyhledávání: '"Chih Sheng Wu"'
Publikováno v:
Medicina, Vol 54, Iss 5, p 68 (2018)
Jejunal varices are a rare manifestation of portal hypertension, and they are associated with a high mortality and poor prognosis when bleeding occurs. A bleeding jejunal varix is much more challenging to diagnose and manage because of its anatomic l
Externí odkaz:
https://doaj.org/article/daa67a9482d14fa59496e98afadd7b8c
Publikováno v:
Medicina, Vol 54, Iss 5, p 68 (2018)
Medicina
Medicina
Jejunal varices are a rare manifestation of portal hypertension, and they are associated with a high mortality and poor prognosis when bleeding occurs. A bleeding jejunal varix is much more challenging to diagnose and manage because of its anatomic l
Autor:
Kuan-Fu Liao, Wei-Wen Su, Jen-Chieh Huang, Cheng Yuan Peng, Sheng-Li Yan, Chun-Che Lin, Chieh-Ling Yen, Shih-Tien Chen, Chih-Sheng Wu, Tsung-Ming Chen
Publikováno v:
Clinical Hepatology.
Background Hepatitis B virus (HBV) relapse is a practical issue after nucleos(t)ide analogue (NA) therapy discontinuation in chronic hepatitis B (CHB). However a prospective multi-centre study remains lacking. The aim of this study was to prospective
Publikováno v:
Biomedical Research. 29
Cronkhite-Canada Syndrome (CCS) is a rare, non-hereditary disease characterized by gastrointestinal polyposis associated with diarrhea and epidermal manifestations, such as hyperpigmentation, alopecia, and onychodystrophy. The pathogenesis of CCS is
Publikováno v:
Neurocomputing. 143:347-361
Artificial neural networks (ANNs) have been successfully applied to many areas. The key of success is to properly tune the architecture and the connection weights of the ANN and to have the trained ANN own higher generalization ability. For complicat
Publikováno v:
Thin Solid Films. 544:530-536
The integration of thin film technology into the fabrication of semiconductor transistors has given rise to significant challenges in the design of multi-level back-end-of-line interconnects. The interfacial adhesion between Al metal and TiN barrier
Publikováno v:
Microelectronic Engineering. 107:107-113
With the impressive size shrinkage of advanced transistors and Cu/low-k interconnect systems, the introduction of through-silicon via integrated with three-dimensional (3D) chip-stacking approaches has become one of the major packaging technologies t
Autor:
Chih-Sheng Wu, Tai-Hung Chen, Kuo-Shu Kao, Tsung-Fu Yang, John H. Lau, Chau-Jie Zhan, Chang-Chun Lee, C. W. Fang
Publikováno v:
Microelectronic Engineering. 107:101-106
Multi-scale modeling construction and subsequent stress analysis for the mechanical reliability estimation of three-dimensional (3D) integrated circuit (IC) packages is challenging. This paper presents a simulation-based methodology to calculate the
Publikováno v:
Journal of Convergence Information Technology. 6:347-356
This paper utilizes a statistical fusion method to extract the characteristic information for keystrokebased authentication (KA) systems to verify users’ identities. The keystroke data is based on the time instances of pressing and releasing a key,
Publikováno v:
Taiwania, Vol 48, Iss 4, Pp 239-247 (2003)
The genus Sciaphila (Triuridaceae) is revised based on comparative morphological and palynological studies in Taiwan. Four species are recognized, i. E. Sciaphila arfakiana Becc., S. Maculata Miers, S. ramosa Fukuy. & T. Suzuki, and S. secundiflora T