Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Chih Horng Chang"'
Publikováno v:
Journal of Applied Physics; Mar2008, Vol. 103 Issue 6, p063518, 4p, 1 Color Photograph, 1 Diagram, 1 Graph
Publikováno v:
Journal of Materials Research. 24:2628-2637
Ternary Sn-In-Cu alloys are prepared and equilibrated at 250 °C for 2 to 20 weeks. The phases formed in these alloys are experimentally determined. The 250 °C Sn-In-Cu isothermal section is established according to the phase equilibrium information
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eac964ff4425b495c48d8b48a8dd2117
https://doi.org/10.1557/jmr.2009.0317
https://doi.org/10.1557/jmr.2009.0317
Publikováno v:
Journal of Materials Research. 23:2743-2748
Ni–7 wt% V diffusion barrier is commonly used in flip chip technology, and Sn is the primary element of all commercial electronic solders. Different from the interfacial reactions in the Sn/Ni couples, a ternary T phase is formed in the Sn/Ni–7 w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3015a1e2250186306aa86e02f762899
https://doi.org/10.1557/jmr.2008.0338
https://doi.org/10.1557/jmr.2008.0338
Publikováno v:
Journal of Materials Research. 23:1895-1901
Sn–0.7 wt% Cu alloy is an important Pb-free solder, and Ni–7 wt% V is the major diffusion barrier layer material of flip chip technology. Reactions at the Sn–0.7 wt% Cu/Ni–7 wt% V interface are examined at 160, 180, and 210 °C. Only the Cu6S
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::779a47eb11106ffc1d7c3b7061afa072
https://doi.org/10.1557/jmr.2008.0235
https://doi.org/10.1557/jmr.2008.0235
Publikováno v:
Metallurgical and Materials Transactions A. 38:2832-2842
This work explores how the Cu/Mg ratio affects the thermal stability of the extrusion of Al-4.6 pct Cu-Mg-Ag alloys at aerodynamic heating temperatures of up to 155 °C for 1000 hours. The Cu/Mg ratio was modified by adding various amounts of element
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d33f109b04f40da9dc13432b6c88e277
https://doi.org/10.1007/s11661-007-9332-1
https://doi.org/10.1007/s11661-007-9332-1
Publikováno v:
Scripta Materialia. 56:453-456
In the early stage of the Sn/Ni–7 wt.%V reaction at 200 °C, solid state amorphization reaction occurs and an amorphous T phase layer is formed. After 48 h of reaction, a Ni3Sn4 phase layer is formed between Sn and the T phase, and the reaction pat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4988b2765043428bc90cb165d3d3967
https://doi.org/10.1016/j.scriptamat.2006.12.002
https://doi.org/10.1016/j.scriptamat.2006.12.002
Publikováno v:
Corrosion Science. 48:3139-3156
Effect of heat treatments (namely T6, T73, RRA, OP1 and OP2) on the tensile strength (TS) and stress corrosion cracking (SCC) resistance of aluminum alloy 7050 in 3.5% NaCl solution at pH 12 has been investigated using constant extension rate tester
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f231f8ad3edb79d3fd6e9b6107b91159
https://doi.org/10.1016/j.corsci.2005.11.009
https://doi.org/10.1016/j.corsci.2005.11.009
Publikováno v:
Materials Chemistry and Physics. 91:454-462
A201 aluminum alloy, Al–4.6Cu–0.3Mg–0.6Ag, is a high-strength as-cast alloy which is strengthened by Ω-phase and θ′-phase. The Ω-phase is a thermal stable strengthening phase, and the θ′-phase is known as the strengthening phase of the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46ce24ef6f3c14fac4bc4da883b5b3a9
https://doi.org/10.1016/j.matchemphys.2004.12.009
https://doi.org/10.1016/j.matchemphys.2004.12.009
Publikováno v:
MATERIALS TRANSACTIONS. 46:236-240
The effect of Ag concentrations of up to 0.9 mass% on the precipitation of the strengthening phases in Al-4.6Cu-0.3Mg casting alloy were investigated. Microstructural features were elucidated by optical microscopy, electron probe X-ray microanalysis,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2e0b1a51969e1abddf1395530b58669
https://doi.org/10.2320/matertrans.46.236
https://doi.org/10.2320/matertrans.46.236
Publikováno v:
Journal of Materials Research. 16:2680-2686
Barium-strontium titanate (BST) thin films were prepared by a two-step deposition using radio-frequency magnetron sputtering on Pt/Ti/SiO2-buffered Si(100) substrate. The initial BST layer thickness and intermediate annealing strongly affect the resu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::89bf9b3a3b04926b0864fcedfd138283
https://doi.org/10.1557/jmr.2001.0367
https://doi.org/10.1557/jmr.2001.0367