Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Chienchih Chen"'
Autor:
Chienchih Chen, 陳建志
96
An Atmospheric Pressure Plasma Enhanced Nanoparticle Synthesis (APPENS) process was proposed to produce nitrogen doped (N-doped) titanium dioxide (TiO2) visible light photocatalyst. The effect of N-doping statuses on the photocatalytic activi
An Atmospheric Pressure Plasma Enhanced Nanoparticle Synthesis (APPENS) process was proposed to produce nitrogen doped (N-doped) titanium dioxide (TiO2) visible light photocatalyst. The effect of N-doping statuses on the photocatalytic activi
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/91151200537979383991
Autor:
Chu-Chuan Hsu, Chien-Shu Tsai, Kuang-Feng Cheng, Chienchih Chen, Ting-Chung Tsai, Jen-Yao Lee
Publikováno v:
Modern Economy. 10:474-483
In this paper, we explore the influence of union structure and wage pricing strategies on the welfare under a mixed oligopoly which has a public firm with budget constraint. We showed that, the total utilities of the decentralized unions are higher t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77938a190906e44924fd752a293ec580
https://doi.org/10.4236/me.2019.102032
https://doi.org/10.4236/me.2019.102032
Publikováno v:
Evidence-based Complementary and Alternative Medicine : eCAM
Evidence-Based Complementary and Alternative Medicine, Vol 2019 (2019)
Evidence-Based Complementary and Alternative Medicine, Vol 2019 (2019)
Background. We aimed to assess whether electroacupuncture (EA) at PC6 affects gastric motility via the vagovagal reflex and if so whether brainstem vagovagal neurocircuits and related transmitters are involved. Methods. Gastric motility was measured
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::28250475600e0888c1bf702fbe8803af
Publikováno v:
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
The study of solder joint reliability is one of the priority issues in electronic packaging. Solder alloys experience a highly nonlinear material behavior when subject to thermal cycling. It is a time consuming and difficult task to study the behavio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c89b22b9e95329310565eedbc6dc3e5d
https://doi.org/10.1115/ipack2018-8398
https://doi.org/10.1115/ipack2018-8398
Publikováno v:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
The finite element method has been widely used to enable fatigue life predictions for electronic assemblies subjected to thermal cycling. The potential critical region of interest within a solder joint is relatively small relative to the entire packa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7db26ea8c8892c9972a7aed60f4e4bf8
https://doi.org/10.1109/itherm.2018.8419533
https://doi.org/10.1109/itherm.2018.8419533
Publikováno v:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
The reliability study of solder joints is one of the primary issues in lead free electronic assemblies, and life testing of electronic assemblies is often performed using time consuming thermal cycling life tests. Finite element analysis often provid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bc04e8afe0377ab95a8e2f65105e48d
https://doi.org/10.1109/itherm.2018.8419498
https://doi.org/10.1109/itherm.2018.8419498
Publikováno v:
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Finite Element simulations are often used to study the reliability of solder joints subjected to thermal cycling. Packaging configurations are becoming more complex to accommodate better functionality and performance. Increased complexity leads to se
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c170dc5a4fc9096856da50972715bd89
https://doi.org/10.1109/itherm.2017.7992651
https://doi.org/10.1109/itherm.2017.7992651
Autor:
Kuang-Hua Chang1 khchang@ou.edu, Chienchih Chen1 chienchih.chen-1@ou.edu
Publikováno v:
Computer-Aided Design & Applications. 2011, Vol. 8 Issue 5, p681-692. 12p. 5 Illustrations.
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Plastic Ball Grid Array (PBGA) technologies are among the most popular and cost effective methods for packaging of medium to high I/O count semiconductor chips. Computational simulations with three dimensional finite element analysis (FEA) software a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4138562cb3540802b35c53223d6af6d6
https://doi.org/10.1109/itherm.2016.7517583
https://doi.org/10.1109/itherm.2016.7517583
Publikováno v:
Journal of Nanoparticle Research. 13:4739-4748
Oxygen-vacant titanium dioxide (TiO2−x ) nanoparticles were synthesized using thermal plasma as a heating source at various applied plasma currents and He/Ar ratios. Samples with diverse characteristics were developed and the mercury removal effect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4b3a77ac2cedb188fedabb355c95913
https://doi.org/10.1007/s11051-011-0442-8
https://doi.org/10.1007/s11051-011-0442-8