Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Chien-Lung Liang"'
Autor:
Mavindra Ramadhani, Andromeda Dwi Laksono, Chien-Lung Liang, Chiao-Yi Yang, Kuo-Jung Chen, Yee-Wen Yen, Hsien-Ming Hsiao
Publikováno v:
Materials, Vol 16, Iss 22, p 7196 (2023)
The phase equilibria of the Ag-Al-Au ternary system and the solid-state reaction couple for the Au-xAg/Al system were investigated isothermally at 450 °C. By investigating the Ag-Al-Au ternary system and its isothermal section, this study aims to pr
Externí odkaz:
https://doaj.org/article/fc8e3c1fcf0741ebb8d2f258e90de848
Publikováno v:
AIP Advances, Vol 5, Iss 12, Pp 127210-127210-6 (2015)
A dislocation density of as high as 1017 /m2 in a tin strip, as revealed by high resolution transmission electron microscope, was induced by current stressing at 6.5 x 103 A/ cm2. The dislocations exist in terms of dislocation line, dislocation loop,
Externí odkaz:
https://doaj.org/article/7a806336cac14806b90ded9bb68b3c11
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f69616a251baee3143bdf0b3b46c90bd
https://doi.org/10.1109/ectc51906.2022.00061
https://doi.org/10.1109/ectc51906.2022.00061
Publikováno v:
Acta Materialia. 200:200-210
The literature has accumulated plenty of interesting findings of electromigration-induced phenomena in pure Sn. Most of the researches revealed the thermodynamically steady states of materials under electromigration. We presented a comprehensive stud
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4364ce7dc9ad12126179dddb0d14c287
https://doi.org/10.1016/j.actamat.2020.09.010
https://doi.org/10.1016/j.actamat.2020.09.010
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:19318-19331
The use of Pb-containing solders in electronic products has been restricted due to their harm to both human health and the environment. Although the Sn–37Pb solder has been well replaced by Sn–3.0Ag–0.5Cu or other Pb-free solders, there is no d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b524d77da53cfd8ab5a60938a557a2f
https://doi.org/10.1007/s10854-020-04466-5
https://doi.org/10.1007/s10854-020-04466-5
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d3ccd370cff2f01822e77585cb86c40
https://doi.org/10.2139/ssrn.4013639
https://doi.org/10.2139/ssrn.4013639
Autor:
Min-Lung Huang, I-Ting Lin, Sheng-Wen Yang, Min-Yan Tsai, Chien-Lung Liang, Jen-Kuang Fang, Kwang-Lung Lin, Yung-Sheng Lin
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
We presented in this article an in situ electromigration behavior in a novel Cu tall pillar/Cu via interconnect. A Cu tall pillar connecting to a single Cu via for joining the fan-out Cu redistribution lines (RDLs) was introduced for high-power devic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b653a47d7fd58f6967870aa59c97d12
https://doi.org/10.1109/ectc32696.2021.00062
https://doi.org/10.1109/ectc32696.2021.00062
Autor:
Chien Lung Liang, Kwang-Lung Lin
Publikováno v:
Journal of Alloys and Compounds. 789:336-344
The non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by electromigration was investigated, for the first time, under room temperature. The sub-micron dimension solder interconnect was fabricated using a magnetron sputtering
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a092c8d16afc55a68aee01736aaae70
https://doi.org/10.1016/j.jallcom.2019.03.055
https://doi.org/10.1016/j.jallcom.2019.03.055
Autor:
Chien Lung Liang, Kwang-Lung Lin
Publikováno v:
Materials Letters. 236:607-610
The present study, for the first time, revealed the athermal recrystallization behavior at a heterogeneous metallic interface using room temperature electromigration. The athermal recrystallization occurred within the meta-stable amorphous Cu-Sn inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9881121b0225c3c2b2e773ea797fa3a7
https://doi.org/10.1016/j.matlet.2018.11.034
https://doi.org/10.1016/j.matlet.2018.11.034
Publikováno v:
Scripta Materialia. 212:114586
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::daa8fa05e348acb0a31501141b54284f
https://doi.org/10.1016/j.scriptamat.2022.114586
https://doi.org/10.1016/j.scriptamat.2022.114586