Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Chien Chia Chiu"'
Publikováno v:
Key Engineering Materials. :533-536
The predicted fatigue life of packaging structures using conventional procedures of finite element analysis (FEA) would be higher than an actual condition as a result of the perfect bonding interface assumed in the modeling. Actually, the crack exten
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::491b9015949d276b2d0a4f5254367bb0
https://doi.org/10.4028/www.scientific.net/kem.326-328.533
https://doi.org/10.4028/www.scientific.net/kem.326-328.533
Publikováno v:
Key Engineering Materials. :521-524
As the interconnection density of electronic packaging continues to increase, the fatigueinduced solder joint failure of surface mounted electronic devices become one of the most critical reliability issues in electronic packaging industry. Especiall
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8b9957e277dfc929729df2cd35a1d94
https://doi.org/10.4028/www.scientific.net/kem.326-328.521
https://doi.org/10.4028/www.scientific.net/kem.326-328.521
Publikováno v:
Journal of Reinforced Plastics and Composites. 25:99-114
This study employs the coupled field method of thermal analysis with the structural method to simulate the thermal conduction and mechanical behaviors of flip-chip packages. The full, one-quarter symmetrical, one-eighth symmetrical, and stripped fini
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4029cd2f91304335828598e2b598aacb
https://doi.org/10.1177/0731684406055459
https://doi.org/10.1177/0731684406055459
Autor:
Bahareh Banijamali, Suresh Ramalingam, Cheng-chieh Hsieh, Tsung-Shu Lin, Shin-Puu Jeng, Doug C. H. Yu, Chien-Chia Chiu, Clark Hu, Shang-Yun Hou, Liam Madden
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
TSV (Through Silicon Via)-based interposer has been proposed as a multi-die package solution to meet the rapidly increasing demand in inter-component (e.g. CPU, GPU and DRAM) communication bandwidth in an electronic system. The stacked-silicon die pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ad4f5c3be03d6a55b3b0c3a7b879033
https://doi.org/10.1109/ectc.2013.6575547
https://doi.org/10.1109/ectc.2013.6575547
Publikováno v:
Materials Science and Engineering: B. 31:287-291
Thermal diffusivity, heat capacity, and thermal conductivity of Al2O3Ni composite with 5 vol.% of Ni particulate were investigated. The thermal conductivity of the composite increases monotonically with increase of Ni particle size, and approaches
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::34f26ece8a7fc74b8ffe38c8c1fa64f8
https://doi.org/10.1016/0921-5107(94)01163-x
https://doi.org/10.1016/0921-5107(94)01163-x
Autor:
Chien-Chia Chiu, Jinn-Kong Sheu, Kai-Bin Lin, Yan-Kuin Su, Gou-Chung Chi, Shoou-Jinn Chang, Chia-Cheng Liu
Publikováno v:
Solid-State Electronics. 42:1867-1869
In this study, H + ion implantation was used to form high resistive regions in an AlGaInP/GaInP multi-quantum well (MQW) gain guided laser diode. The electrical derivative was used to characterize the properties of the fabricated laser diodes. The eq
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a8f19c64bb92cad926e019a047e1f83
https://doi.org/10.1016/s0038-1101(98)00148-8
https://doi.org/10.1016/s0038-1101(98)00148-8
Publikováno v:
56th Electronic Components and Technology Conference 2006.
Electromigration is a reliability concern of microelectronic interconnections, especially for flip chip solder bump with high current density applied. This study shows that with the line-to-bump geometry in a flip chip solder joint, the current densi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc0c3a2fdf1ce323d5f13070ade6b321
https://doi.org/10.1109/ectc.2006.1645801
https://doi.org/10.1109/ectc.2006.1645801
Autor:
Chien-Chia Chiu, 邱建嘉
92
This study focuses on the reliability of flip chip package under the loading of cyclic temperature. The Finite Element Analysis code is used to simulate the thermal conduction and the mechanical behavior of flip chip package. The results reve
This study focuses on the reliability of flip chip package under the loading of cyclic temperature. The Finite Element Analysis code is used to simulate the thermal conduction and the mechanical behavior of flip chip package. The results reve
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/647624
