Výsledky vyhledávání - "Chiara Renghini"

Akademický článek

Feasibility Investigation of SIW Cavity-Backed Patch Antenna Array for Ku Band Applications

Autor: Onofrio Losito, Vincenza Portosi, Giuseppe Venanzoni, Francesco Bigelli, Davide Mencarelli, Paolo Scalmati, Chiara Renghini, Pasquale Carta, Francesco Prudenzano

Publikováno v: Applied Sciences, Vol 9, Iss 7, p 1271 (2019)

A cavity-backed microstrip patch antenna array was optimized in the Ku band. The backing cavity was designed under each patch antenna of the array in order to increase the bandwidth and minimize the intercoupling among the radiating elements. Substra

Externí odkaz: https://doaj.org/article/3395aed54bf04071bf31932f51582995

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Towards the Automated Coverlay Assembly in FPCB Manufacturing: Concept and Preliminary Tests

Autor: Paolo Scalmati, Chiara Renghini, Vito Basile, Irene Fassi, Marcello Valori, Simone Pio Negri

Publikováno v: IPAS 2020 International Precision Assembly Seminar-Smart Technologies for Precision Assembly, pp. 36–50, Online, 14/12/2020-15/12/2020
info:cnr-pdr/source/autori:Valori M.; Basile V.; Negri S.P.; Scalmati P.; Renghini C.; Fassi I.;/congresso_nome:IPAS 2020 International Precision Assembly Seminar-Smart Technologies for Precision Assembly/congresso_luogo:Online/congresso_data:14%2F12%2F2020-15%2F12%2F2020/anno:2021/pagina_da:36/pagina_a:50/intervallo_pagine:36–50
IFIP Advances in Information and Communication Technology
9th International Precision Assembly Seminar (IPAS)
9th International Precision Assembly Seminar (IPAS), Dec 2020, Held virtually, Unknown Region. pp.36-50, ⟨10.1007/978-3-030-72632-4_3⟩
IFIP Advances in Information and Communication Technology ISBN: 9783030726317

In modern electronics, flexible and rigid-flex PCBs are largely used due to their intrinsic versatility and performance, allowing to increase the available volume, or enabling connection between unconstrained components. Rigid-flex PCBs consists of r

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::859748eb3745d914d284bb2e2c20073b
https://publications.cnr.it/doc/452672

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Feasibility Investigation of SIW Cavity-Backed Patch Antenna Array for Ku Band Applications

Autor: Paolo Scalmati, Francesco Prudenzano, Davide Mencarelli, Pasquale Carta, Giuseppe Venanzoni, Onofrio Losito, Chiara Renghini, Francesco Bigelli, Vincenza Portosi

Publikováno v: Applied Sciences
Volume 9
Issue 7
Applied Sciences, Vol 9, Iss 7, p 1271 (2019)

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1ec292422a9b9f6baf82c14659faf59a
http://hdl.handle.net/11589/169745

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DUAL-BAND SUBSTRATE INTEGRATED WAVEGUIDE RESONATOR BASED ON SIERPINSKI CARPET

Autor: Michele A. Chiapperino, Onofrio Losito, Tiziana Castellano, Giuseppe Venanzoni, Luciano Mescia, Giacomo Angeloni, Chiara Renghini, Pasquale Carta, Francesco Prudenzano

Publikováno v: Scopus-Elsevier

In this paper, a dual-band Substrate Integrated Waveguide (SIW) resonator with Sierpinski fractal geometry is proposed. The space-filling property of the employed fractal shape allows to reduce the resonator size. The bandwidth, the minimum insertion

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::874a3d45b76dde95df97482246b929a0
https://doi.org/10.2528/pierc14111306

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FEASIBILITY INVESTIGATION OF LOW COST SUBSTRATE INTEGRATED WAVEGUIDE (SIW) DIRECTIONAL COUPLERS

Autor: Chiara Renghini, Davide Mencarelli, Pasquale Carta, Giuseppe Venanzoni, Luciano Mescia, Giacomo Angeloni, Francesco Prudenzano, Tiziana Castellano, Onofrio Losito, Michele Alessandro Chiapperino

Publikováno v: Progress In Electromagnetics Research B. 59:31-44

In this paper, the feasibility of Substrate Integrated Waveguide (SIW) couplers, fabricated using single-layer TACONIC RF-35 dielectric substrate is investigated. The couplers have been produced employing a standard PCB process. The choice of the TAC

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3a800555b1788bef1f39746cf7aee8b3
https://doi.org/10.2528/pierb14010806

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Full-mesh optical backplane with standard MM fiber ribbons

Autor: Vito Basile, Domenico Coviello, Pierpaolo Boffi, Irene Fassi, Paolo Scalmati, M. Falcucci, Mario Martinelli, Chiara Renghini, Maddalena Ferrario

Publikováno v: Optical Interconnects XVI.

A new optical backplane solution is proposed for high-capacity ICT apparatus. A modular, scalable and full-mesh bandwidth-upgradable optical interconnection between optoelectronic boards is guaranteed thanks to an optimized layout of standard MM 12-f

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5b371e8963fea46627cd41b159c6eebe
https://doi.org/10.1117/12.2208916

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Design and Fabrication of a Dielectricless Substrate-Integrated Waveguide

Autor: Francesco Bigelli, Davide Mencarelli, Chiara Renghini, Antonio Morini, Paolo Scalmati, Marco Farina, Giuseppe Venanzoni

A process for the fabrication of dielectricless rectangular waveguides (RWGs) integrated in the substrate is presented and experimentally validated. First, two complementary circuits are realized through milling the guide in a substrate and, then, ar

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bb4eb2dc91499b138b98305185e6b49e
http://hdl.handle.net/11391/1390214

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Full-Mesh Optical Backplane with Modular Fiber Ribbon-based Sub-Circuits

Autor: Vito Basile, Matteo Falcucci, Mario Martinelli, Irene Fassi, Domenico Coviello, Pierpaolo Boffi, Chiara Renghini, Maddalena Ferrario

Publikováno v: OFC
OFC 2016 Optical Fiber Communications Conference and Exposition, Anaheim, California United States, 20-24/03/2016
info:cnr-pdr/source/autori:Maddalena Ferrario, Domenico Coviello, Pierpaolo Boffi, Vito Basile, Irene Fassi, Matteo Falcucci, Chiara Renghini, Mario Martinelli/congresso_nome:OFC 2016 Optical Fiber Communications Conference and Exposition/congresso_luogo:Anaheim, California United States/congresso_data:20-24%2F03%2F2016/anno:2016/pagina_da:/pagina_a:/intervallo_pagine
Scopus-Elsevier

A modular, scalable and full-mesh bandwidth-upgradable optical interconnection between optoelectronic boards is guaranteed thanks to an optimized layout of standard MM fiber ribbons which divides the overall backplane into independent optical sub-cir

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::938149ba363c0e8e8803abf5237674a1
https://doi.org/10.1364/ofc.2016.th2a.56

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Characterization of Porosity in a Laser Sintered MMCp Using X-Ray Synchrotron Phase Contrast Microtomography

Autor: Gianni Albertini, V. Calbucci, Chiara Renghini, Jack Dyson, E. Girardin, Francesca Moroncini

Publikováno v: Materials Sciences and Applications. :1322-1330

Direct Laser Sintering (DSL), a technology enabling the production of dense metal components directly from 3D CAD data, was used for the first time to produce a Metal Matrix Composite (MMCp) based on Al-Si-Cu alloy in view of its application in diffe

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::430a774459ed163c9064bb0367dd1c06
https://doi.org/10.4236/msa.2011.29180

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