Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Chiang-Ming Chuang"'
Autor:
Chiang-Ming Chuang, 莊強名
90
Vibration failure can occur in soldering joints of chips through mechanical vibration. In particular, when the vibration frequency meets the resonance, the rate of failure is even higher. However, the current understanding of vibration fatigu
Vibration failure can occur in soldering joints of chips through mechanical vibration. In particular, when the vibration frequency meets the resonance, the rate of failure is even higher. However, the current understanding of vibration fatigu
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/88730256760186135808
Publikováno v:
Journal of Electronic Materials. 33:1-6
The tensile strengths of bulk solders and joint couples of Sn-3.5Ag-0.5Cu, Sn-3.5Ag-0.07Ni, and Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge solders and the shear strengths of ball grid array (BGA) specimens, solder-ball-attached Cu/Ni/Au metallized substrates were
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2739d8534caeb061a689c6227b09587
https://doi.org/10.1007/s11664-004-0286-4
https://doi.org/10.1007/s11664-004-0286-4
Publikováno v:
Journal of Electronic Materials. 33:7-13
The interfacial interaction between the Sn-8.55Zn-0.5Ag-0.5Ga-0.1Al solder and three kinds of metallized substrates (Cu, Cu/Au, and Cu/Ni-P/Au) does not form the Cu-Sn intermetallic compound (IMC). Continuous Cu-Zn and discontinuous Ag-Zn interfacial
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97933bf8066c363720b7a8bef47cfea8
https://doi.org/10.1007/s11664-004-0287-3
https://doi.org/10.1007/s11664-004-0287-3
Autor:
Kwang-Lung Lin, Chiang-Ming Chuang
Publikováno v:
Journal of Electronic Materials. 32:1426-1431
Three kinds of Sn-Ag-based lead-free solders, Sn-3.5Ag-0.7Cu, Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge, and Sn-3.5Ag-0.07Ni (in wt.%), were selected to explore the effect of microelements (Ni and Ge) on the interfacial reaction between the solder and the Cu subs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c84c7c70c1d7848a207911ecf246fb45
https://doi.org/10.1007/s11664-003-0111-5
https://doi.org/10.1007/s11664-003-0111-5
Publikováno v:
Journal of Materials Science. 37:191-195
The effects of the addition of aluminum and natural aging on the tensile properties of Sn-9Zn and Sn-9Zn-0.5Al were investigated in rapidly solidified bulk specimens. Because oxidation occurs from the eutectic cell boundary of the surface and grows s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cea176f0c46f9ce623cecf76fead631a
https://doi.org/10.1023/a:1013143218738
https://doi.org/10.1023/a:1013143218738
Publikováno v:
Journal of Materials Research. 16:2644-2652
According to resonant vibration fatigue tests, near-eutectic and Pb-rich hypoeutectic Pb–Sn specimens have higher crack-propagation resistance. The tensile flow stress of Pb–Sn solders that are near eutectic composition increases with decreasing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::396848e7d6f38a617c1a3d9a27f85730
https://doi.org/10.1557/jmr.2001.0363
https://doi.org/10.1557/jmr.2001.0363
Publikováno v:
Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002..
Several Sn-Ag-Cu lead-free solders and two kinds of metallic substrates, Cu and Cu/Ni/Au, were selected to explore the effect of microelements (Ni and Ge) on the interfacial reaction between solder and substrates. When solders reacted with Cu substra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7bb26f353b25b06c0d2077376a75994
https://doi.org/10.1109/emap.2002.1188865
https://doi.org/10.1109/emap.2002.1188865
Publikováno v:
Proceedings of the 4th International Symposium on Electronic Materials & Packaging, 2002; 2002, p360-365, 6p
Publikováno v:
Journal of Materials Research; Aug2004, Vol. 19 Issue 8, p2471-2477, 7p, 7 Black and White Photographs, 3 Graphs
Publikováno v:
Journal of Electronic Materials; Jan2004, Vol. 33 Issue 1, p7-13, 7p, 9 Diagrams, 1 Chart, 1 Graph