Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Chia-Jung Tu"'
This study focuses primarily on the business operating departments (hereinafter, DMUs) of a case telecom company (hereinafter, the Company) in the northern and eastern areas of Taiwan. In 2007, the Company finished the first stage of its reorganizati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f158429e11fe4f797ac779f6ee0ee229
https://doi.org/10.1108/s2514-465020170000001008
https://doi.org/10.1108/s2514-465020170000001008
Publikováno v:
Tetrahedron. 69:1801-1807
In this study, we have successfully synthesized the click cluster of β-cyclodextrin (β-CD) and NH2-terminated poly(amido amine) (PAMAM) dendrons via efficient Cu(I)-catalyzed azide–alkyne cycloaddition (CuAAC). The highly water-soluble click clus
Publikováno v:
Sustainability, Vol 8, Iss 9, p 928 (2016)
Sustainability; Volume 8; Issue 9; Pages: 928
Sustainability; Volume 8; Issue 9; Pages: 928
Energy is a critical factor of economic growth, but the overuse of it results in global warming and climate change. Hence, energy efficiency improvement can help mitigate climate change and prevent economic losses or even ecological extinction. The d
Autor:
Chia-Jung Tu, 杜佳蓉
104
Among the dendrimers, melamine based dendrimer (also called triazine dendrimer) is potential and considering in biomedical application owing to the simplicity and variety in its synthetic route and various products could be easily obtained b
Among the dendrimers, melamine based dendrimer (also called triazine dendrimer) is potential and considering in biomedical application owing to the simplicity and variety in its synthetic route and various products could be easily obtained b
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/19019536230112612932
Autor:
Chia-Jung Tu, Yuanchen Chang
Publikováno v:
Review of Financial Economics. 21:82-89
Using data from MSCI Taiwan Index adjustments, we study analyst responses to stock additions from 1999 to 2007. The empirical results show that the magnitudes of changes in analysts' earnings-per-share forecasts are similar to those of their two benc
Autor:
Chia-Jung Tu
Publikováno v:
The International Journal of Business and Finance Research. 6(4):59-71
Using Nikkei 225 Index adjustment data, this study examines price response to changes in index composition. This study demonstrates that prices of stocks added to and deleted from the Nikkei 225 Index respectively fluctuate accordingly on the announc
Autor:
Chia-Jung Tu, Tyrone T. Lin
Publikováno v:
Journal of Interdisciplinary Mathematics. 10:459-477
This study applies the real options approach to elucidate investment timing for venture capital companies. This analysis attempts to determine the optimal hitting time t* that makes the gross value of project at maturity time T of initial public offe
Autor:
Chia-Jung Tu, Tyrone T. Lin
Publikováno v:
Journal of Information and Optimization Sciences. 28:111-128
This study designs optimal loan quality models for a two-period loan market. Specifically, this work explores whether enterprise and individual provide the guarantees for loan credit and whether financial institution repackages the rights of the loan
Autor:
Shih-Chieh Chang, Yung Shen Wu, Chih-Ming Kuo, Wei-Hsin Wu, Chuan-Yu Wu, Kung-An Lin, Lung-Hua Ho, Chih-Hsien Ni, Chia-Jung Tu, Fei-Jain Wu
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Fine-pitch three-dimensional (3D) interconnects have become a favored choice for next-generation packaging technology, helping to meet industry demands for small form factors, large bandwidth, and low power requirements in electronic devices. Critica
Autor:
Chin-Tang Hsieh, Hsu You-Ming, Fei-Jain Wu, Chih-Ming Kuo, Shih-Chieh Chang, Chih-Hsien Ni, Hui-Yu Huang, Lung-Hua Ho, Chia-Jung Tu, Chuan-Yu Wu, Kung-An Lin
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Fine pitch vertical interconnect has been extensively studied to meet the demand of next generation 3D packaging requirements. Copper pillar bump has received much of attentions as the choice for connecting chips due to its fine pitch and favorable r