Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Chia-Hao Yen"'
Autor:
Hsin-Yu Chen, Hsien-Te Peng, Chin-Kang Chang, Fu-Ting Wang, Chia-Hao Yen, Tsung-Yang Wang, Hsiang-Chun Chuang, Fang-Yao Chiu, Chen-Yi Song
Publikováno v:
Applied Sciences, Vol 12, Iss 15, p 7593 (2022)
Foot orthotics are recommended for the treatment of hallux valgus. The effects of customized foot orthoses (FOs) designed with both medial longitudinal and transverse arch supports are poorly understood, however. This study aimed to investigate the i
Externí odkaz:
https://doaj.org/article/d2fa03f4c0b245808ad28a7e87f4ffcd
Autor:
Chia-Hao Yen, 閻家浩
96
Taiwan is striding forward to service economy right now. Therefore, contact employees play direct and important role in service environment. In service-based organization, service firms should build up a good supportive environment for those
Taiwan is striding forward to service economy right now. Therefore, contact employees play direct and important role in service environment. In service-based organization, service firms should build up a good supportive environment for those
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/19656253975745685321
Publikováno v:
2009 3rd International Conference on Anti-counterfeiting, Security, and Identification in Communication.
RFID is emerging as an important technology for revolutionizing a wide range of applications in our daily life. A security protocol for RFID tags is necessary to ensure the privacy and authentication between each tag and their reader. In this paper,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b0aa91bdb27782d86181336a2dda5e34
https://doi.org/10.1109/icasid.2009.5276910
https://doi.org/10.1109/icasid.2009.5276910
Publikováno v:
2007 International Conference on Electronic Materials and Packaging.
BGA socket is most important part in the final testing which selects the good or bad chip of BGA packages. When testing BGA-type packages using a BGA socket, the characteristic contact conditions and mechanisms of surface degradation in a low and sta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::226fb382d471bab40bde8f03f5bb0da1
https://doi.org/10.1109/emap.2007.4510290
https://doi.org/10.1109/emap.2007.4510290
Publikováno v:
2009 3rd International Conference on Anti-counterfeiting, Security & Identification in Communication; 2009, p229-232, 4p
Publikováno v:
2007 International Conference on Electronic Materials & Packaging; 2007, p1-6, 6p