Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Chi-Wen Pan"'
Publikováno v:
IET Computers & Digital Techniques, Vol 17, Iss 2, Pp 43-59 (2023)
Abstract This paper presents a compact thermal model for smartphones, Phone‐nomenon 2.0, to predict the thermal behavior of smartphones. In the beginning, non‐linearities of internal and external heat transfer mechanisms of smartphones and a comp
Externí odkaz:
https://doaj.org/article/d34590afba4a437d98f3e9307e24673c
Autor:
Chi-Wen Pan, 潘啟文
95
Over the past twenty years, the wavelet transform has become a standard technique in many fields such as signal processing, computer vision and data compression. In these applications, the signals to be processed are usually sampled, so the d
Over the past twenty years, the wavelet transform has become a standard technique in many fields such as signal processing, computer vision and data compression. In these applications, the signals to be processed are usually sampled, so the d
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/84906940207059828805
Autor:
Chi-Wen PAN, Wei-Fang WANG
Publikováno v:
Journal of Nursing; Apr2024, Vol. 71 Issue 2, p90-96, 7p
Publikováno v:
Proceedings of the 28th Asia and South Pacific Design Automation Conference.
Autor:
Lin Yi-Jou, Hsu Wen-Sung, Kuo Sheng-Liang, Chia-Hao Hsu, Yi-Hsuan Peng, Chi-Wen Pan, Tai-Yu Chen
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Unprecedented computing power is pursued for the next generation of big data, cloud computing and artificial intelligence, and it is driving all kinds of new technology in semiconductor industry now. Integrated fan-out on substrate (InFO_oS) packagin
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
When power consumption in smartphones becomes much higher, several significant impacts occur due to its small form factor, such as performance degradation and worse user experience. Thus, power estimation/mapping is essential and useful for dynamic p
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
As the race of CMOS technology continues, process node has shrunken from micrometer to 7 nanometer nowadays. One of the advantages with the advanced process node is that lower operating voltage comes with it and therefore the dynamic power has been l
Publikováno v:
ASP-DAC
This work presents a system-level thermal simulator, Phone-nomenon, to predict the thermal behavior of smartphone. First, we study the nonlinearity of internal and external heat transfer mechanisms and propose a compact thermal model. After that, we
Publikováno v:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In conventional smartphone system thermal analysis, system on chip (SoC) was deemed as one single heat source which was an effective way to identify integrated circuit (IC) and skin thermal problem. However, as the heterogeneous computing architectur