Zobrazeno 1 - 10
of 104
pro vyhledávání: '"Chi-Tsung Chiu"'
Autor:
Chi-tsung Chiu, 邱基綜
92
The thesis consisted of three parts. The first part introduced designed trend of the embedded passive component and the process flow of organic substrate. A design flow of spiral inductor embedded in 4 layer organic substrate has been demonst
The thesis consisted of three parts. The first part introduced designed trend of the embedded passive component and the process flow of organic substrate. A design flow of spiral inductor embedded in 4 layer organic substrate has been demonst
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/96391824878379737023
Publikováno v:
Journal of Nanoscience and Nanotechnology. 17:4712-4715
In this paper, a process scheme for polymer TSV fabrication is proposed to solve the difficulty of polymer liner formation in TSV technology. By using ring trench etching and BCB deposition in a vacuum environment, uniform BCB liner can be successful
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::267fcb5b8e924b32ea1fca4be4b9463c
https://doi.org/10.1166/jnn.2017.13464
https://doi.org/10.1166/jnn.2017.13464
Autor:
David Tarng, Yung-Da Chiu, Chi-Tsung Chiu, Allenyl Chen, An-Tai Wu, Shiu-Chih Wang, Louis Chen
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Copper plating has been extensively employed in the fabrication of embedded packaging to reach high-density, high-speed, high performance electronic products. With through holes (TH) as well as blind via aspect ratios increase, development of a relia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2201ea7315bde3b488eeeecb00996971
https://doi.org/10.1109/ectc.2019.00219
https://doi.org/10.1109/ectc.2019.00219
Autor:
Wei Hwang, Yan-Pin Huang, Kuan-Neng Chen, Ho-Ming Tong, Ching-Te Chuang, Yu-San Chien, Ruoh-Ning Tzeng, Jin-Chern Chiou, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Chi-Tsung Chiu
Publikováno v:
IEEE Transactions on Electron Devices. 61:1131-1136
Low-temperature (170°C) Cu/In wafer-level and chip-level bonding for good thermal budget has been successfully developed for 3-D integration applications. For the well-bonded interconnect, Cu2In and Cu7In3 phases with high melting temperature of 388
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b39e348f8034af42707b711269c85bf
https://doi.org/10.1109/ted.2014.2304778
https://doi.org/10.1109/ted.2014.2304778
Autor:
Jin-Chern Chiou, Ho-Ming Tong, Ching-Te Chuang, Chi-Tsung Chiu, Yu-Chen Hu, Shih-Wei Lee, Kuan-Neng Chen, Kuo-Hua Chen, Wei Hwang, Cheng-Hao Chiang
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:001817-001845
Three-dimensional (3D) integration method has become the candidate to extend the Moore's law due to its heterogeneous integration, multiple functionality, and low power consumption. To realize 3D integration, Through-silicon via (TSV) has emerged as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ab19a91480bf5e848955cad4e3a2d36
https://doi.org/10.4071/2013dpc-tha12
https://doi.org/10.4071/2013dpc-tha12
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:1370-1377
A simple and effective technique for designing transformer-type Marchand baluns is presented in this paper. The coupled-line sections required in a Marchand balun design are realized using planar transformers with a scalable model. The proposed desig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a03db447a5287034dd164f64835fddba
https://doi.org/10.1109/tcpmt.2011.2171514
https://doi.org/10.1109/tcpmt.2011.2171514
Autor:
Kuan-Neng Chen, Chi-Tsung Chiu, Ching-Te Chuang, Cheng-Hao Chiang, Ho-Ming Tong, Jin-Chern Chiou, Lei-Chun Chou, Chung-Hsi Wu, Po-Tsang Huang, Shih-Wei Lee, Kuo-Hua Chen, Shang-Lin Wu, Wei Hwang, Chih-Wei Chang
Publikováno v:
IEEE Electron Device Letters. 35:256-258
Bio-signal probes providing stable observation with high quality signals are crucial for understanding how the brain works and how the neural signal transmits. Due to the weak and noisy characteristics of bio-signals, the connected interconnect lengt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b939916dab2c5b73603f14cbd5cdca27
https://doi.org/10.1109/led.2013.2293399
https://doi.org/10.1109/led.2013.2293399
Autor:
Jian-Yu Li, Chien-Hsun Chen, Cheng-Chung Chen, Chi-Tsung Chiu, Tzyy-Sheng Horng, Chien-Hsiang Huang, Pao-Nan Lee
Publikováno v:
Microwave and Optical Technology Letters. 52:547-551
This letter presents very small LC resonator-based bandpass filters on an organic substrate for wireless system applications. Because of the lack of a fabrication process for high-capacitance density capacitors on the applicable substrate, the propos
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08c0252abeacba51a1007c38fa1a9157
https://doi.org/10.1002/mop.24966
https://doi.org/10.1002/mop.24966
Publikováno v:
IEEE Transactions on Advanced Packaging. 32:636-643
Resonance noise, or power/ground bounce noise, on the power and ground planes of high-speed circuit packages is one of the main concerns of signal integrity or power integrity issues. A novel time-domain approach is proposed to synthesize the broadba
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ff129e64b989d6792140661fc99296b
https://doi.org/10.1109/tadvp.2009.2023510
https://doi.org/10.1109/tadvp.2009.2023510