Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Chi-Lun Lu"'
Autor:
Chi-lun lu, 呂其倫
99
Heavy rainfall frequently occurs in the summer in Taiwan due to the effects of the stationary fronts and typhoons. In recent years, the climatic anomalies tend to induce more extreme weather. For example, record-breaking heavy rainfall induce
Heavy rainfall frequently occurs in the summer in Taiwan due to the effects of the stationary fronts and typhoons. In recent years, the climatic anomalies tend to induce more extreme weather. For example, record-breaking heavy rainfall induce
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/00031120032574790661
Autor:
Chi-Lun Lu, 呂其倫
93
CDO is a correlation product. The investors of this product involve correlation risks since the prices of respective tranches depend on joint default correlations. To determine a fair return for bearing the correlation risks, the investors mu
CDO is a correlation product. The investors of this product involve correlation risks since the prices of respective tranches depend on joint default correlations. To determine a fair return for bearing the correlation risks, the investors mu
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/06950492733798355135
Publikováno v:
SPIE Proceedings.
A proper surface treatment, such as O2 plasma, helps to improve particle removal efficiency (PRE) because of the formation of hydrogen bonding between particles, water and the mask surface after treatment. The effectiveness of surface treatments cann
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38650fcbce28a87ee29be204ec0f3bbb
https://doi.org/10.1117/12.2197675
https://doi.org/10.1117/12.2197675
Publikováno v:
SPIE Proceedings.
We investigated methods to extend the damage-free process window for fragile Sub-Resolution Assist Features (SRAF) in mask cleaning using MegaSonic and binary spray techniques. Particle removal efficiency (PRE) was found to increase by 8% and damage
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdf5a4e3338cd2eb396149d78ca98b3b
https://doi.org/10.1117/12.2028484
https://doi.org/10.1117/12.2028484
Publikováno v:
SPIE Newsroom.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a91dd709770c2667ba5ef098d03d71a
https://doi.org/10.1117/2.1201212.004559
https://doi.org/10.1117/2.1201212.004559
Publikováno v:
SPIE Proceedings.
As semiconductor manufacturing advances to sub-20-nm nodes, specification (size < 50 nm) for extremely fine particles on photomasks is getting more and more stringent. Photomask cleanliness, which seriously impacts manufacturing cycle time and produc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::17655d1e2282685a2f49d5f416416b72
https://doi.org/10.1117/12.975822
https://doi.org/10.1117/12.975822
Autor:
L. Y. Hsia, Yao Ching Ku, Hsin-Chang Lee, T. H. Cheng, Wen-Chuan Wang, Chi-Lun Lu, S. C. Chang
Publikováno v:
SPIE Proceedings.
As the geometry of semiconductor devices continue to scale down, high-NA imaging will be used to enhance the resolution. Sub-resolution assistant features are used to gain depth of focus at the wafer. One of the challenges in patterning small assista
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73095f3ac44ab89abbe84d17d21c0b66
https://doi.org/10.1117/12.728928
https://doi.org/10.1117/12.728928
Autor:
Kuei-Shun Chen, Wen-Chuan Wang, Sheng-Chi Chin, Hsin-Chang Lee, Chi-Lun Lu, Yao Ching Ku, Ru-Gun Liu, Chih-Cheng C. Chin, Ren-Guey Hsieh, Hung-Chang Hsieh, John Lin, Shih-Ming Chang, Cherng-Shyan Tsay, Yung-Sung Yen
Publikováno v:
SPIE Proceedings.
The control of global critical dimension uniformity (GCDU) across the entire mask becomes an important factor for the high-end masks quality. Three major proceses induce GCDU error before after-developing inspection (ADI) including the E-Beam writing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ccb759fb6c0396db300d7ca01047e3d
https://doi.org/10.1117/12.518008
https://doi.org/10.1117/12.518008
Autor:
Hung-Chang Hsieh, Chi-Lun Lu, Wen-Chuan Wang, Shih-Ming Chang, Chih-Cheng C. Chin, Shinn-Sheng Yu, Angus Chin
Publikováno v:
SPIE Proceedings.
In this paper, a quantitative evaluation of mask quality in the domain of 2D pattern fidelity and a method of assessing the OPC model effectiveness are investigated. The spirit of our algorithm is to characterize the wafer lithographic performances o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d7fe53abe6abd90598577dcab6cac0d
https://doi.org/10.1117/12.518041
https://doi.org/10.1117/12.518041
Autor:
Burn-Jeng Lin, Hung-Chang Hsieh, Ren-Guey Hsieh, Chia-Jen Chen, Chi-Lun Lu, Wen-Chi Chen, Hsin-Chang Lee
Publikováno v:
SPIE Proceedings.
The specifications of mask critical dimension (CD) have become much tighter for sub-100nm nodes to satisfy wafer CD uniformity requirements. The small patterns produced by aggressive optical proximity correction compound the difficulty, thereby neces
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4eab149ac1b8396880960a9c26c946b4
https://doi.org/10.1117/12.518285
https://doi.org/10.1117/12.518285