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Fabrication and characterization of Cu pellet using Powder Metallurgical method

Autor: Chew Pei Yi, You Ah Heng, Vijayaram Thoguluva Raghavan

Publikováno v: 2012 10th IEEE International Conference on Semiconductor Electronics (ICSE).

Pure Cu is prepared using by Powder Metallurgical (PM) method in order to study the impact of different sintering environment (with vacuum, N 2 and N 2 + H 2 ) and at different temperatures (1010 °C and 1080 °C) towards its surface and inner morpho

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::443cf75fb53935f2814aeebbe8ac6a04
https://doi.org/10.1109/smelec.2012.6417178

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Filler size influence on moldabilty of high density QFN package

Autor: Kathleen Ong, Lee Swee Kah, Chew Pei Yi, Queck Kian Pin

Publikováno v: 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).

In today semiconductor's market, in order to fulfill the requirements of the growing mobile GPS market for higher sensitivity, higher immunity against interference of cellular signals and low power consumption, the new QFN package named TSNP 11-2 had

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::54dec828458ce4e2b0d6462503ffa5ac
https://doi.org/10.1109/iemt.2010.5746696

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Notice of Retraction: Influence of wafer fabrication technology on wire bond process

Autor: Chew Pei Yi

Publikováno v: 2010 2nd International Conference on Computer Engineering and Technology.

Wire bond process is the main area bringing the package into functionality as it plays the main role into connecting between chip and lead frame. Therefore, the main concern in this process is the bond ability and reliability of the process. This pap

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::3d0632210864791848b9494cd9e5d504
https://doi.org/10.1109/iccet.2010.5486249

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