Zobrazeno 1 - 10
of 94
pro vyhledávání: '"Chew LY"'
Autor:
Kangvansura, Praewpilin, Chew, Ly May, Kongmark, Chanapa, Santawaja, Phatchada, Ruland, Holger, Xia, Wei, Schulz, Hans, Worayingyong, Attera, Muhler, Martin
Publikováno v:
In Engineering June 2017 3(3):385-392
Autor:
Kangvansura, Praewpilin, Chew, Ly May, Saengsui, Worasarit, Santawaja, Phatchada, Poo-arporn, Yingyot, Muhler, Martin, Schulz, Hans, Worayingyong, Attera
Publikováno v:
In Catalysis Today 15 October 2016 275:59-65
Publikováno v:
In Catalysis Today 15 July 2016 270:85-92
Autor:
Chew, Ly May, Kangvansura, Praewpilin, Ruland, Holger, Schulte, Hendrik J., Somsen, Christoph, Xia, Wei, Eggeler, Gunther, Worayingyong, Attera, Muhler, Martin
Publikováno v:
In Applied Catalysis A, General 22 July 2014 482:163-170
Publikováno v:
In Journal of Catalysis November 2013 307:84-93
Publikováno v:
In Journal of Energy Chemistry March 2013 22(2):312-320
Akademický článek
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Autor:
Guan Huei Lee, Muthiah, Daniel Q. Huang, Quek Wl, Iyer Sg, Chahed H, Tan Exx, Chen M, Suryadi, Chew Ly, Raj P, Tan Ek, Cheng S, James Fung, Albert C. Y. Chan, Hoe J
Publikováno v:
SSRN Electronic Journal.
Background: Liver transplantation (LT) activities during the COVID-19 pandemic have been curtailed in many countries which has led to increased percentage of waitlist deaths. The impact of various policies restricting LT on outcomes of patients on th
Autor:
CHEW, LY1, RULAND, HOLGER1, SCHULTE, HENDRIK1, XIA, WEI1, MUHLER, MARTIN1 muhler@techem.rub.de
Publikováno v:
Journal of Chemical Sciences. Mar2014, Vol. 126 Issue 2, p481-486. 6p.
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Conductive adhesive has been one of the popular choices for die attachment on PCB NiAu substrate. However, typical conductive adhesive has the lowest thermal and electrical conductivity among all die attach material. Consideration of silver sinter pa