Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Cheung-Wei Lam"'
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 64:1313-1320
Publikováno v:
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC).
Autor:
Zhekun Peng, David Pommerenke, Ali Foudazi, Daryl G. Beetner, Shubhankar Marathe, Dong-Hyun Kim, Hossein Rezaei, Giorgi Maghlakelidze, Cheung-Wei Lam
Publikováno v:
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
Touchscreen displays can be susceptible to sparkless electrostatic discharge events. The energy observed by sensitive touchscreen circuitry can vary significantly with design parameters like the glass thickness, the capacitance between the sensor pad
Autor:
Cheung-Wei Lam
Publikováno v:
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI).
Autor:
Robert Steinfeld, Ankit Bhargava, Federico Centola, Cheung-Wei Lam, Keong Kam, David Pommerenke
Publikováno v:
IEEE Electromagnetic Compatibility Magazine. 1:28-38
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 53:1091-1093
Ringing in the switching waveform of the switching power supply (e.g., synchronous buck converter) is known to cause broadband electromagnetic interference problems in the 30-300 MHz range. The measured switching waveform shows overshoot and, then, e
Autor:
Robert Steinfeld, David Pommerenke, R. Chundru, Cheung-Wei Lam, Zhen Li, Keong Kam, Federico Centola
Publikováno v:
2011 IEEE International Symposium on Electromagnetic Compatibility.
TVS components are widely used to protect electronic systems from ESD. However, there are various technologies of TVS components as well as numerous manufacturers for each technology. Choosing the right component is not easy, as a typical TVS data sh
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 16:699-704
The finite-difference time-domain method with nonuniform grid is applied to the analysis of novel three-dimensional (3D) multichip module (MCM) interconnects. The vertical interconnects involved in this technology consist of small plated via holes de
Autor:
Robert Steinfeld, Federico Centola, David Pommerenke, Cheung-Wei Lam, Xin Chang, Keong Kam, Ankit Bhargava
Publikováno v:
2009 IEEE International Symposium on Electromagnetic Compatibility.
This paper treats the problem of electromagnetic interference in switched mode power supplies using co-simulation. Co-simulation combines full-wave EM solution with non linear SPICE circuit. Voltages, currents (at different nodes in the circuit) that
Publikováno v:
2009 IEEE International Symposium on Electromagnetic Compatibility.
Synchronous buck converters generate broadband noise typically in 50–300 MHz range. In this paper, the root cause of this broadband noise and possible coupling mechanisms are analysed. Then, a list of EMC design guideline for minimizing the broadba