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Process of electrochemical deposition of copper on a steel and iron substrate from citrate electrolytes was investigated. It is determined that the material of cathode greatly influences the kinetics of copper plating process. Influence of pulse elec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______3992::4330687afa9a56fdc60af68139ff5f5e
https://elib.belstu.by/handle/123456789/6567
https://elib.belstu.by/handle/123456789/6567
