Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Cheong Choke Fei"'
Publikováno v:
PLoS ONE, Vol 9, Iss 5, p e97484 (2014)
The success of printing technology in the electronics industry primarily depends on the availability of metal printing ink. Various types of commercially available metal ink are widely used in different industries such as the solar cell, radio freque
Externí odkaz:
https://doaj.org/article/16c3c18b9cbd47a4be562340730ba2f2
Publikováno v:
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT).
In recent years, flip chip packaging by application of a copper pillar bump as an interconnector within the packages has successfully shrunk the package size to a minimum level, by maintaining or maximizing the chip application functionality. Neverth
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::250b151d76e84e20b2435d63f3638453
https://doi.org/10.1109/iemt.2018.8511764
https://doi.org/10.1109/iemt.2018.8511764
Publikováno v:
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT).
Analysis of semiconductor packages with stacked dies poses a great challenge when assessing the die attach integrity of the different dies. With multiple interfaces already existing within the package it becomes even more difficult if the individual
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2e0e822310c7641fd382e60bf8fcfaf
https://doi.org/10.1109/iemt.2018.8511783
https://doi.org/10.1109/iemt.2018.8511783
Publikováno v:
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
In this study, flakes were analysed using several imaging tools including optical scope, SEM & TEM which were complemented with EDX analysis for elemental investigation of the flakes. Flakes formed on copper bond pad after flux cleaning process were
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b9beebdeb2983b65a2ecf68cf7ca386
https://doi.org/10.1109/ipfa.2018.8452611
https://doi.org/10.1109/ipfa.2018.8452611
Publikováno v:
2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM).
NSOP defect is a common defect faced by IC packaging assembly house. The failure modes normally happen when the wire bond process is not able to bond the wire ball head on the silicon chip bond pad surface. In this analysis, the localized NSOP defect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::929d64ad801b35915886e4796eeebebf
https://doi.org/10.1109/rsm.2017.8069113
https://doi.org/10.1109/rsm.2017.8069113
Autor:
Lai Chin Yung, Cheong Choke Fei
Publikováno v:
2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference.
In copper leadframe fabrication process, anti-oxidant agent is a common chemical solution used to easily protect oxidize surface like copper bond pad surface. There are varieties of anti-oxidant solution available in the market. However, only certain
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::88b542d08bd4982ace35b98f9c23a42c
https://doi.org/10.1109/iemt.2016.7761947
https://doi.org/10.1109/iemt.2016.7761947
Autor:
Cheong Choke Fei, Lai Chin Yung
Publikováno v:
2015 IEEE Regional Symposium on Micro and Nanoelectronics (RSM).
Leadframe fabrication process normally involves additional thin film metal layer plating on the bulk copper substrate surface for wire bond purpose. The recent commonly adopted plating materials are silver, tin, and copper flake. To assess the thickn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::159d7b415b280a954f3ec152301fa016
https://doi.org/10.1109/rsm.2015.7355004
https://doi.org/10.1109/rsm.2015.7355004
Publikováno v:
RSM 2013 IEEE Regional Symposium on Micro and Nanoelectronics.
In current backend assembly house, there is yet standard inspection method available to confirm the incoming bond pad quality. The different severity oxidation level of the bond pad may highly influence the wire bonding process integrity. Due to this
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54982bafed285a2b9e4fc722c9148376
https://doi.org/10.1109/rsm.2013.6706554
https://doi.org/10.1109/rsm.2013.6706554
Publikováno v:
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE).
Based on several studies, package delamination caused by copper oxide is one of the most common IC packaging defects detected in backend assembly processes. The possible root causes for the copper oxide formation could be due to leadframe surface oxi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::95838c1bd83fdffd444ee3d05f3e6cfc
https://doi.org/10.1109/smelec.2012.6417229
https://doi.org/10.1109/smelec.2012.6417229
Autor:
Lee Chai Ying, Cheong Choke Fei
Publikováno v:
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE).
Short time to market is important in ensuring the competitiveness of a new semiconductor product. With the need to pass the listed qualification reliability stress test, temperature cycling (TC) is one of the stress tests that required the most time.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21486c61c865c4c09aa354f648669943
https://doi.org/10.1109/smelec.2012.6417185
https://doi.org/10.1109/smelec.2012.6417185