Zobrazeno 1 - 10
of 54
pro vyhledávání: '"Cheol Ho Heo"'
Autor:
Cheol Ho Heo, Eun Ji Roh, Jaehee Kim, Hyemin Choi, Ho Yeon Jang, Giseong Lee, Chang Su Lim, Inbo Han
Publikováno v:
Journal of Functional Biomaterials, Vol 14, Iss 4, p 192 (2023)
Cyclooxygenase-2 (COX-2) is a biomolecule known to be overexpressed in inflammation. Therefore, it has been considered a diagnostically useful marker in numerous studies. In this study, we attempted to assess the correlation between COX-2 expression
Externí odkaz:
https://doaj.org/article/11b8ddc8871f425997a35106d652dffb
Publikováno v:
Acta Biomaterialia.
Autor:
Hyo-Jong Lee, Seong-Jin Kim, Sang-Hyeok Kim, Hyun Park, Han-Kyun Shin, Seongjae Moon, Cheol-Ho Heo
Publikováno v:
Korean Journal of Metals and Materials. 59:233-238
To manufacture finer solder bumps, the SR and DFR patterns were filled using a Sn electroplating process instead of the microball process currently used in BGA technology, and the solder bump shape was fabricated through a reflow process. The microst
Publikováno v:
The journal of physical chemistry. B. 125(36)
Cellular senescence is the irreversible cell cycle arrest in response to various types of stress. Although the plasma membrane and its composition are significantly affected by cellular senescence, detailed studies on the physical properties of the p
Publikováno v:
Microelectronic Engineering. 200:39-44
Defects, such as a black pads and pinholes, are generated on the Ni/Au interface after the electroless nickel immersion gold (ENIG) process. The contamination of plating solutions, including dissolution of the solder resist (SR), side reaction produc
Publikováno v:
Microelectronics Reliability. 87:75-80
The electroless nickel immersion gold (ENIG) process results in surface defects, such as pinholes and black pads, which weaken the solder joint and eventually degrade the reliability of the PCB. Contamination of the plating solutions, including disso
Characterization of the Contamination Factor of Electroless Ni Plating Solutions on the ENIG Process
Publikováno v:
Journal of Electronic Materials. 47:5158-5164
The electroless nickel immersion gold process often produces defects, such as pinholes and black pads that can cause brittle fractures at the interface between the solder and metal pad. Contamination in electroless Ni plating solutions with increasin
Publikováno v:
The FEBS Journal. 284:2052-2065
α-Syntrophin is a component of the dystrophin-glycoprotein complex that interacts with various intracellular signaling proteins in muscle cells. The α-syntrophin knock-down C2 cell line (SNKD), established by infecting lentivirus particles with α-
Autor:
Ja Young Koo, Hwan Myung Kim, Young-Hee Shin, Dahahm Kim, Chang Su Lim, Cheol Ho Heo, Seung Bum Park, Bong Rae Cho
Publikováno v:
Chemistry - A European Journal. 22:14166-14170
Herein we report 22 acedan-derived, two-photon fluorophores with synthetic feasibility and full coverage of visible wavelength emission. The emission wavelengths were predicted by computational analysis, which enabled us to visualize multicolor image
Publikováno v:
Tetrahedron Letters. 57:715-718
Peroxynitrite (ONOO−), a strong oxidant found in biological systems, and an increase in its levels is related to numerous diseases, immune responses, and redox regulation of signaling pathways. Herein, we report a new two-photon probe that sensitiv