Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Chenping Jia"'
Publikováno v:
ECS Transactions. 16:81-92
One well established technology for the fabrication of 3D devices in microelectronics and micro system technology is wafer bonding. After an overview about the existing bonding techniques the presentation will address aspects like bonding with plasma
Autor:
Yuzhi Lu, Tongjie Xu, Yuhua Liao, Shaofang Nie, Shuang Wen, Ni Xia, Bing Sun, Bingjie Lv, Chenping Jia, Wenyong Dong, Daan Nie, Yuan Yuan Li, Jiao Jiao, Longxian Cheng, Tingting Tang, Zhengfeng Zhu, Xiang Cheng, Wen-cai Zhang, Su-Feng Zhou
Publikováno v:
Cardiovascular research. 106(3)
Aims Recently, interleukin (IL)-9 was found to be involved in the pathogenesis of many inflammatory diseases. Here, we tested whether IL-9 was related to atherosclerosis and investigated the underlying mechanisms. Methods and results IL-9R was expres
Publikováno v:
2011 Semiconductor Conference Dresden.
This paper presents the simulated static and dynamic properties of a micro capacitive transducer by using commercial FEM software - ANSYS. Evaluation of the stress distribution in the stretched membrane of the transducer indicates that the location o
Publikováno v:
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.
In this study we successfully bonded silicon wafer substrates with metal based thermocompression technology. This technology has the advantage of inherent possibility of hermetic sealing and electrical contact. We used three different kinds of metals
Autor:
Thomas Gessner, Maik Wiemer, Marco Haubold, Chenping Jia, Mario Baum, Holger Rank, Achim Trautmann, Arnold Schneider
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
Successful commercialization of MEMS products extremely depends on cost factors. Especially the role of integration technologies like packaging at different levels, combining MEMS with integrated circuits, and to realize 3-dimensional packaged device
Publikováno v:
2008 58th Electronic Components and Technology Conference.
Several wafer bond technologies like direct and anodic bonding without intermediate layer or thermo-compression wafer bonding with intermediate layers like low melting frit glasses, eutectic materials or polymers were developed during the last years
Publikováno v:
IEEE Ultrasonics Symposium, 2005..
n/a
Publikováno v:
IEEE Photonics Journal, Vol 11, Iss 6, Pp 1-13 (2019)
The aerial camera lens largely determines the performance of the camera. It is necessary to further optimize the lens to satisfy the requirements of small-scale and lightweight aircraft camera systems. The optical system design is the primary prerequ
Externí odkaz:
https://doaj.org/article/659b424879b44db8b7feaa77ce6ccdf0
Autor:
BARANSKI, MACIEJ, BARGIEL, SYLWESTER, PASSILLY, NICOLAS, GORECKI, CHRISTOPHE, CHENPING JIA, FRÖMEL, JÖRG, WIEMER, MAIK
Publikováno v:
Applied Optics (1559-128X); 8/1/2015, Vol. 54 Issue 22, p6924-6934, 11p
Autor:
Wencai Zhang, Tingting Tang, Daan Nie, Shuang Wen, Chenping Jia, Zhengfeng Zhu, Ni Xia, Shaofang Nie, Sufeng Zhou, Jiao Jiao, Wenyong Dong, Bingjie Lv, Tongjie Xu, Bing Sun, Yuzhi Lu, Yuanyuan Li, Longxian Cheng, Yuhua Liao, Xiang Cheng
Publikováno v:
Cardiovascular Research; Jun2015, Vol. 106 Issue 3, p453-464, 12p