Zobrazeno 1 - 10
of 92
pro vyhledávání: '"Chengqiang Cui"'
Publikováno v:
Materials, Vol 17, Iss 18, p 4531 (2024)
Tungsten is a metal with many unique characteristics, such as a high melting point, high hardness, high chemical stability, etc. It is widely used in high-end manufacturing, new energy, the defense industry, and other fields. However, tungsten also h
Externí odkaz:
https://doaj.org/article/315eaf170d0c4765812ffe773d51c4ae
Autor:
Jun Cao, Chong Li, Yongzhen Sun, Baoan Wu, Huiyi Tang, Xiaoyu Shen, Kexing Song, Yanjun Zhou, Chengqiang Cui
Publikováno v:
Journal of Materials Research and Technology, Vol 25, Iss , Pp 6578-6592 (2023)
Abstracts: The effects of solution time and aging temperature on the microstructure and properties of C17300 beryllium copper alloy wire were studied by means of SEM, XRD, electronic universal tester and resistance tester. The results show that after
Externí odkaz:
https://doaj.org/article/be0a12b9ac87437a8cc46fc44d2e2c3f
Autor:
Guannan Yang, Shaogen Luo, Bo Luo, Yan Zuo, Shiwo Ta, Tingyu Lin, Zhaohui Zhao, Yu Zhang, Chengqiang Cui
Publikováno v:
International Journal of Smart and Nano Materials, Vol 13, Iss 4, Pp 543-560 (2022)
ABSTRACTConductive fillers made from metal nanoparticles offer many advantages for the fabrication of a variety of electronic devices, but when they have a porous structure, their poor conductivity limits their adoption in many applications. In this
Externí odkaz:
https://doaj.org/article/393d7da4246c40f187352f6d5040386d
Autor:
Guanghan Huang, Jiawei Liao, Chao Fan, Shuang Liu, Wenjie Miao, Yu Zhang, Shiwo Ta, Guannan Yang, Chengqiang Cui
Publikováno v:
Micromachines, Vol 15, Iss 1, p 165 (2024)
Capillary-gradient wicks can achieve fast or directional liquid transport, but they face fabrication challenges by traditional methods in terms of precise patterns. Laser processing is a potential solution due to its high pattern accuracy, but there
Externí odkaz:
https://doaj.org/article/2ee5287756514fe7a5584c627b7fb18f
Autor:
Yu Zhang, Xianchong Yu, Ziyuan Chen, Song Wu, Haiqi Lai, Shiwo Ta, Tingyu Lin, Guannan Yang, Chengqiang Cui
Publikováno v:
Micromachines, Vol 14, Iss 11, p 2079 (2023)
In this study, we present a facile method for preparing oxidation-resistant Cu nanoparticles through a liquid-phase reduction with imidazole compounds (imidazole, 2-methylimidazole, 2-phenylimidazole, and benzimidazole) that serve as protective and d
Externí odkaz:
https://doaj.org/article/3a9f61a7181742c18343d34d2f7b4a8b
Publikováno v:
Journal of Materials Research and Technology, Vol 18, Iss , Pp 2711-2720 (2022)
In this work, we propose a capillarity-promoted laser re-sintering method of printed semisolid Cu nanoparticles for facile fabrication of conductive patterns with voidless structure and improved conductivity. Conductive circuits with a thickness of 5
Externí odkaz:
https://doaj.org/article/4456848a12e54bf8a3fb028b90e9139a
Publikováno v:
Micromachines, Vol 14, Iss 5, p 1030 (2023)
In light of the fact that tungsten wire is gradually replacing high-carbon steel wire as a diamond cutting line, it is particularly important to study tungsten alloy wire with better strength and performance. According to this paper, in addition to v
Externí odkaz:
https://doaj.org/article/8bed400004be46798939223eb8f757c9
Autor:
Jun Cao, Junchao Zhang, Baoan Wu, Huiyi Tang, Yong Ding, Kexing Song, Guannan Yang, Chengqiang Cui
Publikováno v:
Micromachines, Vol 14, Iss 4, p 838 (2023)
The performance of rolling parameters and annealing processes on the microstructure and properties of Cu strip were studied by High Precision Rolling Mill, FIB, SEM, Strength Tester, and Resistivity Tester. The results show that with the increase of
Externí odkaz:
https://doaj.org/article/d1548b735a64412f9400062c9771589e
Publikováno v:
Frontiers in Materials, Vol 9 (2022)
Microvia filling is a core interconnection technique in electronic manufacturing. Electroplating is the primary method used in the industry for filling microvias but also has the drawbacks of cumbersome procedures and toxic by-products. New microvia
Externí odkaz:
https://doaj.org/article/ec9c3f4a6429462abb5e6a24c1432f1e
Autor:
Guannan Yang, Wei Lin, Haiqi Lai, Jin Tong, Junjun Lei, Maodan Yuan, Yu Zhang, Chengqiang Cui
Publikováno v:
Ultrasonics Sonochemistry, Vol 73, Iss , Pp 105497- (2021)
Ultrasonic treatment is an effective method for size refinement and dispersion of nanomaterials during their synthesis process. However, the quantitative relationship between ultrasonic conditions and particle size in the synthesis of metal nanoparti
Externí odkaz:
https://doaj.org/article/2532d915b3934d34aa7b7a51fa41eb47