Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Cheng-Yi Shih"'
Autor:
Cheng-Yi Shih, 施丞苡
101
This study aims to investigate whether current English textbooks used for Taiwan and Hong Kong elementary schools correspond to the principles of Communicative Language Teaching (CLT) in an attempt to make a contribution to English education
This study aims to investigate whether current English textbooks used for Taiwan and Hong Kong elementary schools correspond to the principles of Communicative Language Teaching (CLT) in an attempt to make a contribution to English education
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/15332441186532865677
Autor:
Cheng-Yi Shih, 石政益
98
In this paper, we investigate the short-term stock return performance of UK public acquiring firms with the result of rumors between 1986 and 2009. In difference to Zivney(1996), we divide M&A Rumors into three parts NotRumors, ARumors and Di
In this paper, we investigate the short-term stock return performance of UK public acquiring firms with the result of rumors between 1986 and 2009. In difference to Zivney(1996), we divide M&A Rumors into three parts NotRumors, ARumors and Di
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/95747957897700892058
Autor:
Cheng-Yi Shih, 石正宜
91
GaN related materials have been widely used in blue light emission diodes and laser diodes. The chemical inertness and high bond strength of GaN material do not permit a simple wet etch process for pattern transfer in fabrication of these dev
GaN related materials have been widely used in blue light emission diodes and laser diodes. The chemical inertness and high bond strength of GaN material do not permit a simple wet etch process for pattern transfer in fabrication of these dev
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/42896956638172254921
Autor:
Sk Ziaur Rahaman, Yu-Chen Hsin, Shan-Yi Yang, Yao-Jen Chang, Hsin-Han Lee, Kuan-Ming Chen, I-Jung Wang, Guan-Long Chen, Yi-Hui Su, Cheng-Yi Shih, Shih-Ching Chiu, Chih-Yao Wang, Jeng-Hua Wei, Shyh-Shyuan Sheu, Wei-Chung Lo, Duan-Li Deng, Shih-Chieh Chang
Publikováno v:
2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9cec1d757d0b2200f68227d8efc41127
https://doi.org/10.1109/vlsi-tsa/vlsi-dat57221.2023.10134109
https://doi.org/10.1109/vlsi-tsa/vlsi-dat57221.2023.10134109
Autor:
Yao-Jen Chang, Fang-Ming Chen, Kuan-Ming Chen, Shan-Yi Yang, Yu-Chen Hsin, Sk Ziaur Rahaman, I-Jung Wang, Hsin-Han Lee, Yi-Hui Su, Guan-Long Chen, Cheng-Yi Shih, Shih-Ching Chiu, Jeng-Hua Wei, Shyh-Shyuan Sheu, Wei-Chung Lo, Yuan-Chieh Tseng, Chih-Huang Lai, Denny Tang, Chih-I Wu
Publikováno v:
2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::23aa9b48146bbbe6d72a68b523e2f844
https://doi.org/10.1109/vlsi-tsa54299.2022.9771020
https://doi.org/10.1109/vlsi-tsa54299.2022.9771020
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:2213-2221
Ultrathin glass (UTG) exhibits a great potential for use as a substrate for emerging consumer electronics for weight and profile reduction and flexibility or bendability enhancement. However, the brittle nature of UTG poses critical challenges during
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8de15f21fb0258c6008cb1607eb981b8
https://doi.org/10.1109/tcpmt.2018.2859256
https://doi.org/10.1109/tcpmt.2018.2859256
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
With the rapid development of electronics industry, the printed circuit board (PCB) is the most important indispensable components for various kinds of products such as military, medical, appliances and consumer electronics. At the beginning, the con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2358780f63c60634ceb19c860e6a7932
https://doi.org/10.1109/impact.2016.7800069
https://doi.org/10.1109/impact.2016.7800069
Publikováno v:
Advanced Materials Research. :410-415
Current polishing pads cannot polish a workpiece without using slurry with free abrasive. The new slurry is required to be continually poured into the working area, so more than half of the slurry may be lost from the table without contacting the waf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b17db2503f5f6ccd0dd3b647d2c9245e
https://doi.org/10.4028/www.scientific.net/amr.76-78.410
https://doi.org/10.4028/www.scientific.net/amr.76-78.410
Autor:
Cheng Yi Shih, Pei Lum Tso
Publikováno v:
Key Engineering Materials. :487-492
A mechanical polishing process was used to reduce surface roughness through mechanical fracturing and removal of the substrate’s roughened regions. It was thus necessary to understand the effect of grain size and morphology on the material removal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c58a2e97bfd04a794d066ba76ad58dee
https://doi.org/10.4028/www.scientific.net/kem.389-390.487
https://doi.org/10.4028/www.scientific.net/kem.389-390.487